This is a significant milestone for Japan’s semiconductor industry, marking the first time that an EUV lithography tool will be used for mass production in the country.
PlayNitride Selects Veeco’s Lumina MOCVD System for MicroLED Production
Veeco Instruments Inc. today announced that PlayNitride has qualified Veeco’s Lumina MOCVD system for production of next-generation MicroLEDs, and also placed an order for two systems for delivery in 2025.
Launch of TRENG-PLP Coater: Panel Level Coater for Advanced Semiconductor Packaging
Toray Engineering Co., Ltd. has developed the TRENG-PLP Coater, a high-accuracy coating device for panel level packaging; PLP is an advanced semiconductor packaging technology.
The Rigaku Group’s XwinSys Changes its Name to Rigaku Semiconductor Instruments
To strengthen its manufacturing of equipment for advanced semiconductor packaging.
SEMICON Korea 2025 to Spotlight Edge Technologies Shaping the AI Era
SEMICON Korea 2025 will take place Feb. 19-21 in Seoul at the COEX offering a comprehensive look into AI-driven technological advancements and edge technologies poised to shape the future of the global semiconductor industry.
Student Research Supports Semiconductor Sustainability
TSMC-sponsored projects aim to improve use and manufacturing practices.
SEALSQ Partnering with Hedera in the Next Generation of Post-Quantum Semiconductors
SEALSQ Corp, a company that focuses on developing and selling Semiconductors, PKI and Post-Quantum technology hardware and software products, today announced a strategic partnership with Hedera.
Synopsys and SiMa.ai Announce Strategic Collaboration
Synopsys and SiMa.ai today announced a strategic collaboration to jointly deliver a new solution for automotive companies to accelerate the development of workload-specific silicon and software needed to power artificial intelligence-enabled features in next-generation automobiles.
What’s in the November/December Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the November/December issue.
YES RapidCure Systems Chosen by SkyWater Technology for Fan Out Wafer Level Packaging
YES has chosen the YES RapidCure polymer dielectric curing systems for their implementation of the M-Series fan-out wafer level packaging (FOWLP) technology in partnership with Deca Technologies ‘Deca’.
