The 2021 virtual Design and Verification Conference and Exhibition U.S. (DVCon U.S.), sponsored by Accellera Systems Initiative (Accellera), concluded its 33rd annual event last week.
Microchips of the Future: Suitable Insulators Are Still Missing
For decades, there has been a trend in microelectronics towards ever smaller and more compact transistors. 2D materials such as graphene are seen as a beacon of hope here: they are the thinnest material layers that can possibly exist, consisting of only one or a few atomic layers. Nevertheless, they can conduct electrical currents – conventional silicon technology, on the other hand, no longer works properly if the layers become too thin.
GaN Power Transistor Prices Drop Below $1.00
GaN Systems, the global leader in GaN (gallium nitride) power transistors, today announced that its low current, high volume GaN transistors have fallen below $1.00 USD.
TESCAN Announces 2021 Spring Seminars for Semiconductor and Additive Manufacturing
TESCAN ORSAY HOLDING a.s. announces a new Spring Seminar Series for electron microscopy and micro computed tomography (micro-CT) users worldwide.
With Smart MechatroniX, Bosch Rexroth Offers New Solutions for the Factory of the Future
With the new Smart MechatroniX solution platform, which combines best-in-class linear motion technology components with electronics and software, Bosch Rexroth is responding to market trends in factory automation on the way to the Factory of the Future.
Soitec Reinforces Its Commitments to the “France Relance” Plan
The French Minister of Industry, Agnès Pannier-Runacher, and the electronics industries, including Soitec, reinforced their commitments to the country’s economic recovery plan, “France Relance”, in a meeting at Soitec’s headquarters today.
pSemi Opens New Design Center in India
pSemi Corporation, a Murata company focused on semiconductor integration, announces the opening of a new design center in Chennai, India to support the company’s growing demand for semiconductor products enabling 5G and Internet-of-Things (IoT) applications.
EMD Performance Materials Announces Further Investments of Electronics Business and New Name: EMD Electronics
EMD Performance Materials today announced an expanded focus on the US electronics business and a new name in the US: EMD Electronics.
Intel to Collaborate with Microsoft on DARPA Program
Intel today announced that it has signed an agreement with Defense Advanced Research Projects Agency (DARPA) to perform in its Data Protection in Virtual Environments (DPRIVE) program.
Light in Concert With Force Reveals How Materials Become Harder When Illuminated
When indented by a probe in darkness, wafers of some semiconductors are putty-like. When illuminated by light whose wavelength matches the band gap, they become hard, as electrons and holes freed by the light suppress the propagation of dislocations.
