Transphorm, Inc. (OTCQB: TGAN)—a pioneer in and global supplier of high reliability, high performance gallium nitride (GaN) power conversion products—today released updated information regarding its GaN technology’s quality and reliability (Q+R).
Reliable Quality-Control of Graphene And other 2D Materials Is Routinely Possible
Graphene and other single-atom-thick substances are a category of wonder materials, with researchers the world over investigating their electronic properties for potential applications in technologies as diverse as solar cells, novel semiconductors, sensors, and energy storage.
CEA-Leti to Build Quantum-Photonics Platform to Ensure Ultra-Secure Data for Finance, Energy, Defense and Other Industries
Eyeing future demand for hack-proof digital communication in a quantum-information world, CEA-Leti today announced plans to build a quantum-photonics platform to develop next-generation technologies for key industries that require ultra-secure data transmission.
Kioxia Corporation to Expand 3D Flash Memory Production Capacity by Building New Fabrication Facility at Yokkaichi Plant
Kioxia Corporation today announced it will begin construction of a fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan to expand production of its proprietary 3D Flash memory BiCS FLASH.
An Artificial Cell on a Chip
Researchers at the University of Basel have developed a precisely controllable system for mimicking biochemical reaction cascades in cells.
Surrey Device Takes Us Closer to High-Performing Wearable and Eco-Disposable AI Electronics
The University of Surrey has unveiled a device with unique functionality that could signal the dawn of a new design philosophy for electronics, including next-generation wearables and eco-disposable sensors.
STMicroelectronics Establishes World’s First “Lab-in-Fab” to Advance Adoption of Piezoelectric MEMS in Singapore in Partnership with A*STAR and ULVAC
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a world leader in Micro-Electromechanical Systems (MEMS) technology, announces a collaboration with A*STAR’s IME, a research institute in Singapore, and ULVAC, a leading Japanese manufacturing-tool vendor, to jointly setup and operate an 8-inch (200mm) R&D line focused on Piezo MEMS technology within ST’s existing manufacturing facility in Singapore.
Dialog Semiconductor Partners with Alps Alpine for Automotive Haptic Applications
Dialog Semiconductor plc, a leading provider of battery and power management, Wi-Fi, Bluetooth low energy (BLE) and Industrial IoT solutions, today announced automotive qualification for its DA7280 high-definition haptic driver.
OSRAM Selects Veeco’s Lumina MOCVD System for High-End LED Production and to Drive Next Generation Products
Veeco Instruments Inc. today announced that OSRAM Opto Semiconductors, a leading manufacturer of optoelectronic components, has qualified Veeco’s Lumina MOCVD System for production of high-end LEDs and to drive the next generation of advanced photonic devices.
Ansys Multiphysics Solutions Certified for Samsung Foundry’s Entire Line of FinFET Process Technologies
Ansys achieved new certifications of its leading-edge suite of semiconductor design solutions for all Samsung Foundry FinFET process nodes.
