Recent innovations in the field of new implant materials and innovative packaging are presented.
Scaling the BEOL: A Toolbox Filled with New Processes, Boosters and Conductors
Extending interconnects towards the 3nm technology node and beyond requires several innovations. Imec sees single-print EUV in dual-damascene modules, Supervia structures, semi-damascene modules and added functionality in the back-end-of-line (BEOL) as the way forward.
Harsh New Processes and Materials Pose Challenges for Vacuum Systems
Maximizing the productivity and profitability of the semiconductor manufacturing process requires pump designs that are optimized for the application, especially harsh applications that use condensable or corrosive gases.
Why AIoT is an Essential Element of Continued Technological Innovation
We’re taking a multiplicity of small steps towards a future where AIoT will be deployed widely, in our cars, cities, factories, and stores — and throughout our lives, for the better.
SerDes Designs: Keeping Pace with a Demanding Network Environment
As speed, signal integrity and test boundaries are pushed, cycles of architectural changes and new levels of design innovation for the SerDes chip are only a few of the challenges.
A Gold Butterfly Can Make Its Own Semiconductor Skin
A nanoscale gold butterfly provides a more precise route for growing/synthesizing nanosized semiconductors that can be used in nano-lasers and other applications. Hokkaido University researchers have devised a unique approach for making nanosized semiconductors on a metal surface. The details of the method were reported in the journal Nano Letters and could further research into the fabrication of nanosized light and energy emitters.
MEMS-FHE Device Integration Gets Real
MEMS technology has changed human interaction with electronic devices. Introduced in the 1990s, the first mass-market MEMS devices were used for inkjet printheads and automotive airbag crash sensors. Today, MEMS are ubiquitous, with billions of the tiny devices adding intelligence and interactivity to smartphones, smart speakers, wearables, automobiles, biomedical devices, remote monitoring and event detection systems, and countless other applications. Integrating MEMS with Flexible Hybrid Electronics (FHE) is an important step in the evolution of this miniaturized intelligent sensing technology, paving the way for its use in new classes of flexible, conformal devices.
Flexible Hybrid Electronics Comes to Bio-Interfacing and Biodegradable Electronics at FLEX|MSTC 2020
VTT Technical Research Centre of Finland Ltd (VTT) has its sights set high.
Xperi Enters into New Patent and Technology License Agreement with SK hynix
Xperi Corporation (NASDAQ: XPER) (“Xperi”) today announced that it entered into a new patent and technology license agreement with SK hynix, one of the world’s largest semiconductor manufacturers. The agreement includes access to Xperi’s broad portfolio of semiconductor intellectual property (IP) and a technology transfer of Invensas DBI Ultra 3D interconnect technology focused on next-generation memory.
Plessey Partners with Axus Technology to Deliver its Monolithic MicroLED Displays
Plessey, an embedded technologies developer at the forefront of microLED technology for the augmented reality (AR) and display markets, announces a partnership with Axus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer polishing surface-processing solutions for semiconductor applications, to bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.
