Don’t miss this week’s webcast on Thursday. First, Lita Shon‐Roy, President/CEO of Techcet, will provide an overview of chip level materials markets, focusing on growth and opportunities. Next, SRC’s Jon Candelaria, Director, GRC Interconnect and Packaging Sciences, will describe how today’s researchers are exploring materials challenges beyond Moore’s Law.
Don’t Hack My Light Bulb, Bro
Many people believe that the lowly light bulb might be how the IoT makes it’s way into your home. Even at the light bulb level, security is going to be critical.
Pittsburgh IMAPS Workshop
By Karen Lightman, Executive Director, MEMS Industry Group Packaging means a lot of different things to a lot of different people. Webster’s dictionary defines package as a “group or a number of things, boxed and offered as a unit.” For…
Nakamura Co-Wins Nobel for Blue LEDs
The Nobel Prize in Physics 2014 was awarded jointly to Isamu Akasaki, Hiroshi Amano, and Shuji Nakamura “for the invention of efficient blue light-emitting diodes which has enabled bright and energy-saving white light sources”. In the late 1980s red and…
IBM Shows Graphene as Epi Template
Last month in Nature Communications (doi:10.1038/ncomms5836) IBM researchers Jeehwan Kim, et al. published “Principle of direct van der Waals epitaxy of single-crystalline films on epitaxial graphene.” They show the ability to grow sheets of graphene on the surface of 100mm-diameter…
Sensory Shanghai
It was over 10 years ago that I last visited Shanghai and oh my, how things have changed, most visibly, the skyline. Looking across the Huangpu River from The Bund back then, I clearly remember the ‘Pearl’ TV tower and a few tall buildings and thought how impressive it looked.
Leti integrates everything
Now I know how wafers feel when moving through a fab. Leti in Grenoble, France does so much technology integration that in 2010 it opened a custom-developed people-mover to integrate cleanrooms (“Salles Blanches” in French) it calls a Liaison Blanc-Blanc…
Internet-of-Things Infographic
This infographic, courtesy of Jabil, gives an good overview of what will be connected to the internet by 2020 (even garbage bins!).
The Second Shoe Drops – Now We Have the Samsung V-NAND Flash
Two weeks ago, we posted about the TSMC 20nm product that we had in-house; now after waiting for a year since Samsung’s announcement of V-NAND production, we have that in the lab and can start to see what it looks like.
The Second Shoe Drops – Now We Have the Samsung V-NAND Flash
Two weeks ago, we posted about the TSMC 20nm product that we had in-house; now after waiting for a year since Samsung’s announcement of V-NAND production, we have that in the lab and can start to see what it looks like.
