NHanced Semiconductors President Robert Patti to Deliver Keynote at IEEE 3DIC Conference in Sendai, Japan

At the upcoming IEEE International 3D Systems Integration Conference (3DIC), NHanced Semiconductors president Robert Patti will deliver a keynote address detailing the critical role of advanced packaging in continuing the progress of Moore’s Law in semiconductor development.

ETRI Succeeds in the Development of a p-type Semiconductor Material to Lead Semiconductor Innovation

A group of Korean researchers have recently succeeded in developing new p-type semiconductor materials and thin-film transistors that will lead the innovation of the semiconductor industry.

Heidelberg Instruments Reports Several Installations of its ULTRA Semiconductor Mask Writer as Global Semiconductor Demand Surges

Heidelberg Instruments, a provider of advanced laser lithography systems, is pleased to announce a continued stream of orders for the ULTRA Semiconductor Mask Writer from photomask production groups across the US and Asia.

Dr. Jason Cong to be Honored With 2024 Phil Kaufman Award

Dr. Jason Cong, Distinguished Professor and Volgenau Chair for Engineering Excellence at the University of California, Los Angeles (UCLA), will be honored with the 2024 Phil Kaufman Award for distinguished contributions to Electronic System Design (ESD). 

Polymatech and ECM Group Forge Strategic Joint Venture for Semiconductor Wafer Fabrication in Grenoble, France

The new venture will focus on producing sapphire ingots and wafers, key materials for advanced semiconductor devices.

Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps

Synopsys, Inc. today announced the industry’s first complete UCIe IP solution operating at up to 40 Gbps per pin to address the increased compute performance requirements of the world’s fastest AI data centers.

Samsung Begins Industry’s First Mass Production of QLC 9th-Gen V-NAND for AI Era

Samsung Electronics today announced it has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND).

Omdia Forecasts Say Display Panel Fab Utilization Rate to Drop 14 Percentage Points to 68% in October 2024

Display panel makers forecast are set to make severe cuts to their fab utilization in October 2024, according to Omdia’s Display Production and Inventory Tracker.

PPG Launches PPG STEELGUARD 951 Fire Protection Coating in the Americas

PPG today announced the launch of PPG STEELGUARD 951 epoxy intumescent fire protection coating in the Americas.

What’s in the August/September Issue?

Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the August/September issue.