Infineon Technologies AG today announced that the company has succeeded in developing the world’s first 300mm power gallium nitride (GaN) wafer technology.
Material Export Restrictions Poised to Strain Semiconductors
TECHCET has identified a potential strain on US semiconductor manufacturing capability as Chinese export restrictions on key materials have been announced.
MEMS & Imaging Sensors Summit to Highlight Innovations Driving the Next Generation of Connectivity
The SEMI MEMS & Imaging Sensors Summit, themed Sensor Revolution for a Connected Future, is set to bring together some of the world’s leading minds in sensor technology on November 14 at the International Conference Center Munich (ICM), Germany.
Samtec Orders ClassOne Technology Solstice S8 Single-Wafer System to Process Glass Core Technology Products
ClassOne Technology, a global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has received an order from new customer Samtec for a Solstice S8 single-wafer processing system.
JEDEC Publishes Essential Test Method to Address Switching Energy Loss in Wide Bandgap and Silicon Semiconductor Power Devices
JEDEC Solid State Technology Association today announced the publication of JEP200: Test Methods for Switching Energy Loss Associated with Output Capacitance Hysteresis in Semiconductor Power Devices.
Solving a Memristor Mystery to Develop Efficient, Long-Lasting Memory Devices
Newly discovered role of phase separation can help develop memory devices for energy-efficient AI computing.
xMEMS Micro Speaker Technology Delivers High-Quality Audio to New SOUNDPEATS TWS Earbuds
xMEMS Labs today announced collaboration with SOUNDPEATS to equip its all-new Capsule3 Pro+ TWS earbuds with its Cowell micro speaker.
NXP Combines Ultra-Wideband Secure Ranging and Short-Range Radar to Enable Autonomous Industrial and IoT Applications
NXP Semiconductors N.V. today announced the Trimension SR250, the industry’s first single-chip solution that integrates on-chip processing capabilities with both short-range UWB radar and secure ranging.
Intel Names New Representative to Si2 Board
Intel has a new representative on the Silicon Integration Initiative board of directors.
Boston Semi Equipment Enters Magnetic MEMS Testing Market with Initial Order from Leading Automotive IC Manufacturer
Boston Semi Equipment (BSE) today announced it has received an order from a global manufacturer of sensor integrated circuits (ICs) in the automotive market for its new Zeus handler configuration for magnetic micro-electromechanical systems (MEMS) testing.
