Today’s computers reach their physical limits when it comes to speed. Semiconductor components usually operate at a maximum usable frequency of a few gigahertz – which corresponds to several billion computing operations per second.
Paul V. Walsh, Jr. Joins Kopin Corporation Board of Directors
Kopin Corporation today announced that Paul V. Walsh, Jr. has joined Kopin Corporation’s Board of Directors.
GlobalFoundries and Silicon Catalyst Partner to Accelerate Differentiated Technology Solutions for Semiconductor Startups
GlobalFoundries and Silicon Catalyst, the world’s only incubator+accelerator focused exclusively on semiconductor solutions, today announced that GF has joined the incubator’s semiconductor startup ecosystem as a Strategic Partner and an In-Kind Partner (IKP).
Brooks Instrument Celebrates New Manufacturing Site in Malaysia
Grand opening for the company’s fourth manufacturing facility highlights production and partnership opportunities with key customers in the Asia-Pacific region.
EDA and IP Industries Face Dickensian Quandary – Will Value Win Over Complacency?
Fundamental changes are changing the value of EDA and IP, but not for the better. Will AI be the game changer?
ACM Research Expands Fan-Out Panel-Level Packaging Portfolio with Launch of Ultra C bev-p Bevel Etching Tool
New double-sided bevel etching system enhances process efficiency and reliability in copper-related applications, supporting high-precision features on large panels.
Entegris Appoints Mary Puma to Board of Directors
Entegris, Inc., a supplier of advanced materials and process solutions for the semiconductor and other high-technology industries, today announced the appointment of Mary Puma to its board of directors.
Starting a Fluorescent Biosensor Revolution
Molecular biosensors that only light up upon binding their targets open vast possibilities for medical diagnostics, fundamental research, environmental monitoring, and more.
ROHM and UAES Sign a Long-Term Supply Agreement for SiC Power Devices
ROHM Semiconductor and United Automotive Electronic Systems Co., Ltd. (UAES), a Tier 1 automotive supplier in China, today announced they have entered into a long-term supply agreement for SiC power devices.
Micron Introduces HBM3E 12-high 36GB
Micron’s HBM3E 12-high 36GB delivers significantly lower power consumption than other 8-high 24GB offerings, despite having 50% more DRAM capacity in the package.
