Wafer Level Packaging Reaches New Heights

Fan-out package revenue is expected to surpass $2B by 2025 and fan-in WLCSP revenue to peak to $3B by 2025 as TSMC continues to drive the fan-out market in 5G applications.

A New Wave of Fan-Out Packaging Growth

Key players from different business models are fueling new growth.

CSP Market Forecast – Strong

Chip-Scale Packages (CSP) continue to be in strong demand for IC needing the smallest form-factors for applications including automotive, industrial applications to mobile phones and wearable electronics, according to leading market research firm TechSearch International. TechSearch’s latest CSP market forecast…

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