Singapore’s Five Research Pillars Outlined at SEMICON Southeast Asia

At SEMICON Southeast Asia 2021, Mr. Terence Gan, SVP, Semiconductors, Economic Development Board (EDB) of Singapore, outlined five research pillars.

New Plating Tool for WLP and Plating in Compound Semi Manufacturing

ACM’s Ultra ECP GIII plating tool is designed for WLP for compound semiconductors, with product offerings for SiC, GaN and GaAs. The tool is also capable of plating gold into backside deep hole processes with greater uniformity and better step coverage.

Developing a UHF RFID Reader RF Front End

Two implementations showing how engineers can trade off receiver sensitivity for reduced design complexity, component count, and board space in UHF RFID applications.

Powering Ahead

Integrated RF and tuning networks, solid-state tuning networks, non-sinusoidal bias for tailored ion energy distribution, and predictive power delivery will enable process applications at advanced technology nodes.

RFID Playing Cards “Best Product” at Printed Electronics Europe

Cartamundi, imec and Holst Centre (set up by imec and TNO) recently won the Best Product Award at Printed Electronics Europe for their ultra-thin plastic RFID technology integrated into Cartamundi’s playing cards. In each card, the RFID chip has a…

IoT, Healthcare and 5G to Drive RF and Microwave

Industry trends to the Internet of Things, advanced healthcare and 5G are good news for everyone involved in technologies associated with RF, microwave, millimeter wave, and THz frequencies, many of whom will be attending “Microwave Week” in Phoenix, May 17-22.

Batteries? We don’t need no stinking batteries.

We’re still used to thinking that low-power chips for “mobile” or “Internet-of-Things (IoT)” applications will be battery powered…but the near ubiquity of lithium-ion cells powering batteries could be threatened by capacitors and energy-harvesting circuits connected to photovoltaic/thermoelectric/piezoelectric micro-power sources. At…

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