Challenges and associated solutions in using glass in a standard 300mm Si fab are discussed. We demonstrate that functionalized glass wafers can pass all the requirements to enter a Si fab to enable layer transfer of RF components.
At SEMICON Southeast Asia 2021, Mr. Terence Gan, SVP, Semiconductors, Economic Development Board (EDB) of Singapore, outlined five research pillars.
ACM’s Ultra ECP GIII plating tool is designed for WLP for compound semiconductors, with product offerings for SiC, GaN and GaAs. The tool is also capable of plating gold into backside deep hole processes with greater uniformity and better step coverage.
Two implementations showing how engineers can trade off receiver sensitivity for reduced design complexity, component count, and board space in UHF RFID applications.
Integrated RF and tuning networks, solid-state tuning networks, non-sinusoidal bias for tailored ion energy distribution, and predictive power delivery will enable process applications at advanced technology nodes.
Cartamundi, imec and Holst Centre (set up by imec and TNO) recently won the Best Product Award at Printed Electronics Europe for their ultra-thin plastic RFID technology integrated into Cartamundi’s playing cards. In each card, the RFID chip has a…
Industry trends to the Internet of Things, advanced healthcare and 5G are good news for everyone involved in technologies associated with RF, microwave, millimeter wave, and THz frequencies, many of whom will be attending “Microwave Week” in Phoenix, May 17-22.
We’re still used to thinking that low-power chips for “mobile” or “Internet-of-Things (IoT)” applications will be battery powered…but the near ubiquity of lithium-ion cells powering batteries could be threatened by capacitors and energy-harvesting circuits connected to photovoltaic/thermoelectric/piezoelectric micro-power sources. At…