Murata Electronics Americas announced today that it has created the world’s smallest artificial intelligence (AI) module in partnership with Google – the Coral Accelerator Module. The custom designed module packages Google’s Edge TPU ASIC within a miniaturized footprint. The solution overcomes some of the most pressing challenges in implementing AI solutions by delivering superior noise suppression and simplifying printed circuit board design in a smaller footprint. Miniaturization is key as all board space must be optimized to achieve highly robust functionality in space constrained operations. The result of this collaboration is a solution that speeds up the algorithmic calculations required to execute AI.
Dirac And NXP Announce Collaboration To Equip The NXP i.MX 8M Family Of Chipsets With A Premium Digital Audio Platform
Swedish sound pioneer Dirac and NXP® Semiconductors today announced a collaboration to combine one of the world’s most powerful audio chipsets with a market-leading digital audio platform. By equipping the NXP i.MX 8M family of chipsets with Dirac’s digital audio platform, OEMs can enable their devices with maximized, immersive, and adaptive sound across their complete range of products. This announcement is being made at CES 2020 at Dirac Booth #18123.
NXP Debuts i.MX Applications Processor with Dedicated Neural Processing Unit for Advanced Machine Learning at the Edge
NXP Semiconductors N.V. (NASDAQ: NXPI) today expanded its industry-leading EdgeVerse portfolio with the i.MX 8M Plus application processor – the first i.MX family to integrate a dedicated Neural Processing Unit (NPU) for advanced machine learning inference at the industrial and IoT (Internet-of-Things) edge. The i.MX 8M Plus combines a high-performance NPU delivering 2.3 TOPS (Tera Operations Per Second) with a Quad-core Arm® Cortex-A53 sub-system running at up to 2GHz, an independent real-time sub-system with an 800MHz Cortex-M7, a high-performance 800 MHz audio DSP for voice and natural language processing, dual camera Image Signal Processors (ISP), and a 3D GPU for rich graphics rendering.
Laser Pulse Creates Frequency Doubling in Amorphous Dielectric Material
Researchers have demonstrated a new all-optical technique for creating robust second-order nonlinear effects in materials that don’t normally support them.
Renesas Electronics’ High-Efficiency Power Management IC Adopted in Google Coral AI Products
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced its ISL91301B Power Management IC (PMIC) is designed into the latest Google Coral products. They include the Mini PCIe Accelerator, M.2 Accelerator A+E Key, M.2 Accelerator B+M Key, and System-on-Module (SoM). Google Coral integrates seamlessly into processes at any scale, helping designers create a variety of local artificial intelligence (AI) solutions for several industries.
pSemi Announces the Retirement of Former CEO and Esteemed Executive Jim Cable
pSemi® Corporation, a Murata company focused on semiconductor integration, announces the retirement of former CEO and esteemed executive Jim Cable. After more than 20 years with the company, Cable retires from his position as chairman and CTO of pSemi and as global semiconductor R&D director for parent company Murata Manufacturing. Cable joined pSemi (formerly Peregrine Semiconductor) in Oct. 1996 and held positions as COO and vice president of technology and engineering before becoming CEO in 2002. From 2002 to 2017, he served as CEO, leading the team through explosive growth, funding rounds, an IPO and the 2014 acquisition by Murata.
CES 2020 Opens with Innovation That Will Change the World
CES® 2020 opens today unveiling the next generation of innovation that will redefine industries, create jobs and solve many of society’s challenges. With more than 4,400 exhibiting companies, including 1,200 startups, CES 2020 features the latest transformative technologies, including 5G, artificial intelligence, vehicle technology, digital health and more. Owned and produced by the Consumer Technology Association (CTA)®, CES 2020 runs through Friday, January 10, in Las Vegas, Nevada.
New Method Gives Robust Transistors
A new method to fit together layers of semiconductors as thin as a few nanometres has resulted in not only a scientific discovery but also a new type of transistor for high-power electronic devices. The result, published in Applied Physics Letters, has aroused huge interest. The achievement is the result of a close collaboration between scientists at Linköping University and SweGaN, a spin-off company from materials science research at LiU. The company manufactures tailored electronic components from gallium nitride.
Researchers Create Nanoscale Sensors to Better See How High Pressure Affects Materials
Researchers have developed new nanoscale technology to image and measure more of the stresses and strains on materials under high pressures. As the researchers reported in the journal Science, that matters because, “Pressure alters the physical, chemical and electronic properties of matter.” Understanding those changes could lead to new materials or new phases of matter for use in all kinds of technologies and applications, said Valery Levitas, a paper co-author and Anson Marston Distinguished Professor in Engineering at Iowa State University, the Vance Coffman Faculty Chair and professor in aerospace engineering.
Paving the Way for Spintronic RAMs: A Deeper Look Into a Powerful Spin Phenomenon
Scientists at Tokyo Institute of Technology(Tokyo Tech) explore a new material combination that sets the stage for magnetic random access memories, which rely on spin–an intrinsic property of electrons– and could outperform current storage devices. Their breakthrough published in a new study describes a novel strategy to exploit spin-related phenomena in topological materials, which could spur several advances in the field of spin electronics. Moreover, this study provides additional insight into the underlying mechanism of spin-related phenomena.
