A room-temperature bonding technique for integrating wide bandgap materials such as gallium nitride (GaN) with thermally conducting materials such as diamond could boost the cooling effect on GaN devices and facilitate better performance through higher power levels, longer device lifetime, improved reliability, and reduced manufacturing costs.
Pathways Toward Realizing the Promise of All-Solid-State Batteries
In a review article published in the March 2020 issue of Nature Nanotechnology, nanoengineers at the University of California San Diego offer a research roadmap that includes four challenges that need to be addressed in order to advance a promising class of batteries–all-solid-state batteries–to commercialization. This article summarizes the team’s work to tackle these challenges over the past three years, which have been reported in several peer-reviewed articles published in various journals.
Finding Wafers Just Got Much Easier
Inseto launches comprehensive online store for selecting and ordering silicon, silica, glass, coated and SOI wafers.
Pfeiffer Vacuum Introduces Extremely Quiet, Dry Pumps
The HiScroll models from Pfeiffer Vacuum’s new range of scroll pumps are oil-free, hermetically sealed vacuum pumps with high nominal pumping speeds of 6 to 20 m³/h. The new pumps are characterized by their compact design and quiet, low-vibration operation (<47 dB[A], and <42 dB[A] in stand-by mode).
The Need for IoT Security At the Chip Level
A critical element to successful IoT security chips is public key infrastructure (PKI). All IoT devices with these chips require a strong identity, which will then be used for secure authentication.
