Cadence Design Systems, Inc. today announced that Kneron, a leading provider of on-device edge AI solutions, has integrated the Cadence Tensilica Vision P6 DSP in its next-generation KL720, a 1.4TOPS AI system-on-chip (SoC) targeted for AI of things (AIoT), smart home, smart surveillance, security, robotics and industrial control applications.
Understanding Cooling and Particulate Contamination Challenges for Next Generation ALE Technologies
Mixed-refrigerant Joule-Thomson refrigeration can provide the necessary wafer temperatures and cooling power with smaller footprint, better reliability and lower power consumption than alternative cooling technologies. Cryo-trapping can reduce particle generation by removing the water that mediates the particle formation process.
Lattice Expands CrossLink-NX FPGA Family of Best-in-Class Low Power FPGAs for Smart and Embedded Vision Systems
CrossLink-NX FPGAs deliver the best-in-class low power consumption, small form factor, reliability, and performance that developers need to create innovative embedded vision and AI solutions for compute, industrial, automotive, and consumer markets.
CEA-Leti X-Ray Photon-Counting Detector Modules Target Improved Medical Diagnoses
A novel X-ray photon-counting detector module (PCDM) developed by CEA-Leti and integrated in an X-ray scanner prototype from Siemens Healthineers has shown in clinical trials the potential to revolutionize computed-tomography (CT) scanning by potentially increasing spatial resolution, reducing X-ray exposure to patients, improving image quality by lowering image noise and artifacts, and by distinguishing multiple contrast agents.
A New Way of Modulating Color Emissions from Transparent Films
Scientists are looking at luminescent transparent films for use in energy-efficient displays (such as LED screens) and other applications, and the possibilities it opens up for advancing methodologies in several fields of biological and electronics research.
Continuous and Stable Lasing Achieved from Low-Cost Perovskites at Room Temperature
An international team of researchers led by Kyushu University and Changchun Institute of Applied Chemistry, Chinese Academy of Sciences, has demonstrated stable, continuous lasing at room temperature for over an hour from a class of low-cost materials called perovskites by finally overcoming a phenomenon that has so far prevented such long operation.
Amber Solutions Secures $5.5 Million in Financing and Signs Three New Memorandums of Understanding with Global Manufacturers
Amber Solutions, a technology innovator creating a modern hyper-intelligent electrical architecture, today announced the completion of a new $5.5-million round of financing and the securement of three new memorandums of understanding (MOUs) with leading global manufacturers of electrical products, smart automation systems and silicon chips.
Tachyum Promotes Krishna Thatipelli to Senior Director of Hardware Design Engineering
Tachyum Inc. today announced the promotion of Krishna Thatipelli, a seasoned professional with strong technical and management skills in CPUs and ASIC development, to Senior Director of Hardware Design Engineering after successfully delivering August milestones related to the company’s Prodigy Universal Processor.
Building Patterns From The Bottom: A Complementary Approach to Lithography
With shrinking dimensions, the classical lithography-based top-down patterning processes are becoming extremely complex and expensive. Therefore, researchers worldwide are investigating alternative processes allowing to build patterns from the bottom. Two promising approaches are directed self-assembly (DSA) and area-selective deposition (ASD).
TechSearch International Projects Growth in FO-WLP Market
The fan-out wafer level package (FO-WLP) market is projected to grow 15.5% in units from 2020 to 2024. Growth is driven by use in mobile devices such as smartphones and smartwatches, automotive radar, and increasing adoption in high-performance computing.
