Tachyum Inc. today announced that it has reached another milestone in meeting its goal of volume production of the Prodigy Universal Processor in 2021 by achieving 96 percent of silicon designed and layout completed, with only a stable netlist layout to go before the final netlist and tape out.
Transphorm Appoints Dr. Julian Humphreys to Board of Directors
Transphorm, Inc. —a pioneer in the development and manufacturing of high reliability, high performance gallium nitride (GaN) power semiconductors, today announced the appointment of Dr. Julian Humphreys to the Company’s Board of Directors, effective October 14, 2020.
STMicroelectronics Unveils Features of Multi-Application, Deterministic Automotive Microcontrollers to Maximize Safety and Security in Next-Generation Domain/Zone Architectures
STMicroelectronics has revealed further details of its innovative Stellar automotive microcontrollers (MCUs) to show how the devices ensure reliable and deterministic execution of multiple independent real-time applications.
The Chip Warriors: A Podcast Documentary Series
America won the first cold war by outspending the Soviet Union in nuclear weapons. Many observers believe the US is engaged in a new cold war – with China. If true, it will be fought with technologies like 5G, artificial intelligence and semiconductors – but this time the US is being outspent.
Deca Partners with ADTEC Engineering to Enhance Adaptive Patterning for 2µm Chiplet Scaling
Deca, an industry-leading provider of advanced electronic interconnect technologies, announced today the signing of an agreement with ADTEC Engineering to join its new AP Live Network.
Veeco Announces Aledia Order of 300mm MOCVD Equipment for microLED Displays
Veeco Instruments Inc. (NASDAQ: VECO) today announced that Aledia, a developer and manufacturer of next-generation advanced display applications, has selected Veeco’s Propel 300 HVM metal organic chemical vapor deposition (MOCVD) system for high- resolution microLED displays.
What’s Driving the Next 10 Years of MEMS?
MEMS sensors have come a long way over the past few decades. The late 1990’s brought us the mass production of both MEMS accelerometers for automotive air bag crash sensors and MEMS gyros for rollover detection and anti-locking braking systems (ABS).
EV Group Addresses Key Process Gap in Heterogeneous Integration with Collective Die-to-Wafer Hybrid and Fusion Bonding Demonstration
This breakthrough, which was demonstrated at EVG’s Heterogeneous Integration Competence Center, represents an important milestone in accelerating the deployment of heterogeneous integration (HI) in next-generation 2.5D and 3D semiconductor packaging.
Dialog Semiconductor Licenses its Non-Volatile Resistive RAM Technology to GLOBALFOUNDRIES for 22FDX Platform, Targeting IoT and AI
DIALOG SEMICONDUCTOR and GLOBALFOUNDRIES today announced that they have entered into an agreement in which Dialog licenses its Conductive Bridging RAM (CBRAM) technology to GLOBALFOUNDRIES.
China Forecast to Represent 22% of the Foundry Market in 2020
Despite the Covid-19 shutdown of China’s economy earlier this year, China’s share of the pure-play foundry market is forecast to be 22% in 2020, 17 percentage points greater than it registered in 2010
