CyberOptics Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will present at the Virtual IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) on December 16th at 8:00amCT.
GaN Systems Expands Power Market with GaN Power Module Evaluation Kits
GaN Systems announced the availability of four new integrated power module evaluation kits: 100V Driver GaN DC/DC Power Stage Module, 650V 150A Half-Bridge IPM, 650V 150A Full-Bridge Module and Driver, and 650V 300A 3-Phase Module and Driver.
Micron Reinforces Commitment to Advance Equal Opportunity for All in Annual Diversity, Equality and Inclusion Report
Micron Technology, Inc. today announced the release of its third annual diversity, equality and inclusion (DEI) report, demonstrating advances with regionalized commitments and initiatives across the U.S., Asia and Europe.
Wet Copper Deposition Materials for ICs and Packages
TECHCET announces that the global market for wet metal deposition materials including electro-chemical deposition (ECD) and plating (ECP) chemistry blends in 2020 is forecast to be US$63 million.
CEA-Leti and Davey Bickford Enaex Extend R&D Collaboration To Bring More Digital Solutions to Mining and Blasting Industries That Improve Safety for Workers and Increase Productivity
CEA-Leti and Davey Bickford Enaex, a worldwide leader in blasting solutions, have extended their joint laboratory for three years to continue development of innovative radio-frequency communication systems that remotely control networks of high-tech wireless electronic detonators.
Kandou Raises $92.3 Million in Series C Funding
Kandou, an innovative leader in high-speed, energy-efficient, chip link solutions, today closed its Series C round of funding, resulting in $92.3 million raised in the round.
Coventor and CMC Microsystems Expand Collaboration to Further Enable Innovation in Semiconductor and Microsystem Technology Development
Coventor, a Lam Research Company, and CMC Microsystems, manager of Canada’s National Design Network (CNDN), today announced an expanded technology sharing collaboration, bringing advanced software platforms to Canadian academic and startup organizations.
Professors from Stanford, UC Berkeley to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA) and the Semiconductor Research Corporation (SRC) today announced the winners of the 2020 SIA-SRC University Research Awards.
Mipsology Zebra on Xilinx FPGA Beats GPUs, ASICs for ML Inference Efficiency
Machine learning software innovator Mipsology today announced that its Zebra AI inference accelerator achieved the highest efficiency based on the latest MLPerf inference benchmarking.
BrainChip Demonstrates How Its Akida Technology Is Delivering the Next-Generation of AI at the Edge at First-Ever AI Field Day
BrainChip Holdings Ltd., a leading provider of ultra-low power high performance AI technology, today announced its participation at the AI Field Day 1 virtual event November 18-20.
