The Global 3D TSV Packages Market is valued at $6.1 billion in 2021 and is projected to reach $14.9 billion by 2028 at a CAGR (Compound Annual Growth Rate) of 16.1% over the forecast period 2022-2028.
Market Overview
According to Vantage Market Research, key factors are anticipated to accelerate the 3D TSV packages market growth over the forecast period. The use of 3D TSV packages is anticipated to provide electrical connectivity to surface-mounted devices and mirrored sidewalls to enhance the package’s reflectivity and lighting quality. On the other hand, the global market for 3D TSV packages is projected to benefit from the rising trend toward LED packaging in several ways.
We forecast that the consumer electronics category in 3D TSV packages market sales will account for more than 20% of total sales by 2028. The adoption of 3D TSV packaging increases the endurance of electronic devices. By using more robust packing, it can protect the item from external pressures breaking it.
Market Dynamics
Growing Need For Electrical Device Miniaturisation Will Fuel Market Expansion
The development of the 3D TSV packages sector is driven by the increasing demand for electronic device shrinking brought on by improved compact-size chip architecture. These items will be created by incorporating hetero systems, increasing the dependability of complex packaging. With extremely small MEMS sensors and 3D packaged circuits, it is possible to monitor devices in dangerous environments and place sensors almost anywhere, which helps to increase dependability and uptime in real time. The 3D TSV packages market is driven by rising demand for cutting-edge chip designs with improved properties such as low power consumption, high aspect ratio, and smaller form factors.
Use of LED Packaging to Accelerate Market Growth
LEDs are being used in more items, which has sparked the development of gadgets with higher energy outputs, greater density, and lower costs. In contrast to 2D packaging, 3D packaging through silicon via (TSV) technology enables a high density of vertical interconnections. Future opportunities in the market are largely projected due to advancements in its implementation sectors, such as optoelectronics MEMS, high-end LED solutions, and CMOS image sensors. A combination of monolithic and multifunctional integration is successfully carried out to provide low-power, high-speed interconnections. The integrated TSV circuit minimizes link lengths and calls for lower parasitic capacity, inductance, and resistance.
Top Players in the Global 3D TSV Packages Market
- Amkor Technology Inc. (United States)
- Jiangsu Changjiang Electronics Technology Co. (STATS chipPAC), (China)
- Toshiba Electronics Co. Ltd. (India)
- Samsung Electronics Co. Ltd. (South Korea)
- Taiwan Semiconductor Manufacturing Company Limited (TSMC), (Taiwan)
- United Microelectronics Corporation (Taiwan)
- Xilinx Inc. (United States)
- Teledyne DALSA Inc., (Canada)
- Tezzaron Semiconductor Corporation (United States)
- Sony Corporation (Japan)
- Intel Corporation (United States)
- SK Hynix Inc. (South Korea)
- Invensas Corporation (United States)
- Broadcom Ltd. (United States)
- Pure Storage Inc. (United States)
- ASE Technology Holding Co. Ltd. (Taiwan)
- STMicroelectronics NV (Switzerland)
Top Trends in the Global 3D TSV Packages Market
- One trend that Vantage Market Research (VMR) expects to see in the 3D TSV packages industry is technological advancement. Introducing cutting-edge technologies in the DRAM memory space will probably guarantee the acceptance of 3D TSV packages and hasten the market’s expansion.
- Another trend that VMR predicts will continue in the 3D TSV packages industry is the growing desire for electrical device miniaturization. These goods could be created by integrating heterogeneous systems, resulting in more dependable, sophisticated packaging. MEMS sensors that are incredibly compact and 3D-packed circuits provide real-time equipment monitoring in challenging settings, enabling greater reliability and uptime.
Top Report Findings
- Based on Process Realization, most of the 3D TSV packages market’s revenue is controlled by the via middle category. TSVs with a via in the middle are made after the individual components have been printed but before the metal layers (back-end-of-line, BEOL).
- Based on Application, most of the 3D TSV packages market’s revenue is controlled by the logic & memory devices category. Emerging memory solutions with high performance and portability could be produced using 3D TSV packaging technology, such as flash memory, hybrid memory cube, and others.
- Based on End Users, most of the 3D TSV packages market’s revenue is controlled by the consumer electronics category because smartphones are becoming more widely used worldwide, which is due to the easy availability of high-tech features such as strong camera systems and high-resolution displays, followed by affordable mobile data services in most locations.
