Arteris, Inc., a provider of system IP which accelerates system-on-chip (SoC) creation, today announced that it has joined Intel Foundry Accelerator Ecosystem Alliance Program, as a member of both the IP Alliance and the recently announced Chiplet Alliance.
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.
Siemens and Intel Foundry Advance Collaboration
Siemens Digital Industries Software today announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated foundry reference flows, and additional technology enablement.
Worldwide Silicon Wafer Shipments Increase 2% Year-on-Year in Q1 2025, SEMI Reports
Worldwide silicon wafer shipments increased 2.2% year-on-year (YoY) to 2,896 million square inches (MSI) from the 2,834 MSI recorded during the same quarter of 2024.
Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
At today’s Intel Foundry Direct Connect 2025 event, Synopsys, Inc. announced broad EDA and IP collaborations with Intel Foundry, including availability of its certified AI-driven digital and analog design flows for the Intel 18A process node and production-ready EDA flows for the Intel 18A-P process node with RibbonFET Gate-all-around transistor architecture and the industry’s first commercial foundry implementation of PowerVia backside power delivery.
VSORA Raises $46 Million to Bring World’s Most Powerful AI Inference Chip to Market
VSORA, a French innovator and the only European provider of ultra-high-performance artificial intelligence (AI) inference chips, today announced that it has successfully raised $46 million in a new fundraising round.
Northeast Microelectronics Coalition Hub Launches $10 Million SCALE Capital Program to Advance Microelectronics Industry
The Northeast Microelectronics Coalition (NEMC) Hub, a division of the Massachusetts Technology Collaborative (MassTech) launched the SCALE Capital program, a $10 million grant initiative to advance microelectronics capability, training and product development across Massachusetts.
Veeco’s WaferStorm and WaferEtch Wet Processing Platforms Qualified for Advanced Packaging Applications
Veeco Instruments Inc. today announced a global Semiconductor IDM qualified Veeco’s WaferStorm and WaferEtch platform for two new applications in Advanced Packaging.
HKUST Research Sheds Light on Future Applications in Spintronics and Valleytronics
A team led by Prof. LIU Junwei from the Department of Physics at the Hong Kong University of Science and Technology (HKUST), along with their experimental collaborators, published their latest research findings in Nature Physics, which unveiled the first experimental observation of a two-dimensional layered room-temperature altermagnet, validating the theoretical predictions in Nature Communications made by Prof. Liu in 2021.
DNA-Inspired Design for Stronger, Flexible Sensors for Wearables
The double-helical design places both electrodes at one end, preventing damage that typically occurs when electrodes are pulled at joints.
