ALKU, a specialty staffing firm, today announced the launch of its newest division focused exclusively on the semiconductor industry.
Promex Industries CEO Richard Otte Honored with IEEE Electronics Manufacturing Technology Award
Promex Industries, Inc., a Silicon Valley-based provider of advanced design, packaging, and microelectronics assembly services, today announced that CEO Richard (Dick) Otte has received the 2025 Electronics Manufacturing Technology Award from the IEEE Electronics Packaging Society (EPS).
GlobalFoundries Partners with A*STAR to Accelerate Advanced Packaging Innovation
The collaboration will provide GF with access to A*STAR’s R&D facilities, capabilities and technical support for technology development and workforce skills enhancement in advanced packaging.
Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America
Deca Technologies today announced the signing of an agreement with IBM to implement Deca’s M-Series and Adaptive Patterning technologies in IBM’s advanced packaging facility in Bromont, Quebec.
ClassOne Technology and IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing
ClassOne Technology, a global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has signed a joint development agreement with IBM Research focused on wet processing for advanced packaging.
CEA-Leti Reports Co-Integration of GaN MicroLED and Organic Photodetectors for Multifunctional Display Applications
CEA-Leti today presented its heterogeneous co-integration of GaN microLED technology and organic photodetectors (OPDs), a major step toward multifunctional displays that combine both display and sensing capabilities.
SEMI Reports Typical Q1 2025 Semiconductor Seasonality with Potential for Atypical Shifts Due to Tariff Uncertainty
According to the Q1 2025 Semiconductor Manufacturing Monitor (SMM) Report released by SEMI in collaboration with TechInsights, the global semiconductor manufacturing industry entered 2025 with typical seasonal patterns.
Toshiba and Global Power Technology Accelerate Their Patent Filings on SiC Power Devices
According to data from our SiC Patent Monitor, power silicon carbide (SiC) technology saw robust patenting activity in Q1 2025, with over 840 new patent families filed globally.
Foxconn Builds AI Factory in Partnership With Taiwan and NVIDIA
NVIDIA and Foxconn Hon Hai Technology Group today announced they are deepening their longstanding partnership and are working with the Taiwan government to build an AI factory supercomputer that will deliver NVIDIA Blackwell infrastructure to researchers, startups and industries.
EV Group Forms Subsidiary in Singapore to Strengthen Local Customer Support
Establishment of fully owned subsidiary is the culmination of a decades-long commitment to the region supporting evolving needs in semiconductor wafer fabrication and packaging.
