NEXT Semiconductor Technologies is collaborating with BAE Systems to accelerate the insertion of its latest ultra-wideband antenna processor units (APUs) into high-performing radiation-hardened electronic subsystems to support future space missions.
2024 Global Semiconductor Materials Market Posts $67.5 Billion in Revenue, SEMI Reports
Global semiconductor materials market revenue increased 3.8% to $67.5 billion in 2024, SEMI, the global industry association representing the electronics design and manufacturing supply chain, reported today in its Materials Market Data Subscription (MMDS).
Advanced Semiconductor Packaging Market Forecast to Grow at 7.5% CAGR Through 2031
The Advanced Semiconductor Packaging Market was valued at USD 18090 Million in the year 2024 and is projected to reach a revised size of USD 29800 Million by 2031, growing at a CAGR of 7.5% during the forecast period.
OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment
OKI Circuit Technology has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.
ASIC and SoC Design Partner Rebrands as Aion Silicon
Aion Silicon (formerly Sondrel), a premier ASIC/SoC architecture and design partner, today officially unveiled its new name, vision, and leadership team.
ROHM Develops New High Power Density SiC Power Modules
ROHM Semiconductor today announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC converters in onboard chargers (OBC) for xEVs (electric vehicles).
Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance
Aion Silicon (formerly Sondrel) today announced it has joined the Intel Foundry Accelerator Design Services Alliance.
ChEmpower Secures $18.7M to Advance Abrasive-Free Planarization in Chip Manufacturing
New investment to drive sustainability in advanced AI chip manufacturing.
Microchip Unveils New High-Density Power Module for AI at the Edge Applications
AI at the edge is driving increased integration and power consumption, requiring advanced power management solutions for industrial automation and data center applications.
M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation
M31 Technology Corporation (M31), a global provider of silicon intellectual property (IP), today announced that its eUSB2 PHY IP has achieved silicon-proven status on TSMC’s 3nm process and has successfully completed tape-out on TSMC’s 2nm process.
