Samsung Electronics Co., Ltd. today announced an expansion of its foundry ecosystem to offer a broader Intellectual Property (IP) portfolio for next-generation semiconductor design and production.
Toshiba Digital Solutions and Classiq to Collaborate on Gate-based Quantum Computing
Toshiba Digital Solutions Corporation and Classiq Technologies Ltd. signed a technology collaboration agreement in the gate-based quantum computing.
Synopsys and Samsung Collaborate to Deliver Broad IP Portfolio Across All Advanced Samsung Foundry Processes
Synopsys, Inc. today announced an expanded agreement with Samsung Foundry to develop a broad portfolio of IP to reduce design risk and accelerate silicon success for automotive, mobile, high-performance computing (HPC) and multi-die designs.
D2S Receives Milestone Order for 50th GPU-Based Computational Design Platform for Optimizing Semiconductor Manufacturing
D2S today announced that it has received a milestone order for its 50th GPU-accelerated computational design platform (CDP), a scalable processing solution for simulation-based semiconductor design and manufacturing applications.
Hexagon Partners with Sony Semiconductor Solutions to Enhance Reality Capture
Hexagon AB announced the partnership with Sony Semiconductor Solutions Corporation (Sony) to further advance Hexagon’s reality capture solutions, including the Leica BLK product family.
SiMa.ai Launches Partner Program to Accelerate AI Innovation at the Edge
SiMa.ai, the machine learning company delivering solutions for the embedded edge, today launched its Partner Program with leading vendors in the ML edge marketplace.
Amkor Advanced Packaging Enables the Car of the Future
Amkor Technology, Inc., a provider of semiconductor packaging and test services and the #1 automotive OSAT, is innovating advanced packaging to enable the car of the future.
Global Semiconductor Materials Market Revenue Reaches Record $73 Billion in 2022, SEMI Reports
Global semiconductor materials market revenue grew 8.9% to $72.7 billion in 2022, surpassing the previous market high of $66.8 billion set in 2021, SEMI, the global industry association representing the electronics manufacturing and design supply chain, reported today.
Global 300mm Fab Equipment Spending Forecast to Reach Record $119 Billion in 2026, SEMI Reports
Global 300mm fab equipment spending for front-end facilities next year is expected to begin a growth streak to a US$119 billion record high in 2026 following a decline in 2023, SEMI highlighted today in its quarterly 300mm Fab Outlook Report to 2026.
Fractilia Adds Overlay Metrology Capability to Stochastics Control Solutions
Fractilia Overlay Package offered as an optional feature for Fractilia’s MetroLER and FAME products, which have been adopted by dozens of industry-leading companies
