Adeia Inc. will showcase the latest developments in hybrid bonding technology at the 20th Annual Device Packaging Conference (DPC 2024) on March 18-21, 2024, at the WeKoPa Resort and Conference Center in Fountain Hills, Arizona
Advancing Toward Wearable Stretchable Electronics
Researchers at Stanford have been working on skin-like, stretchable electronic devices for over a decade.
Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
Cadence Design Systems, Inc. today announced a collaboration with Arm to deliver a chiplet-based reference design and software development platform to accelerate software-defined vehicle (SDV) innovation.
Intel Appoints Stacy Smith to Board of Directors
Intel Corporation today announced that Stacy Smith, executive chairman of Kioxia Corporation, formerly Toshiba Memory Corporation, and chair of Autodesk Inc., was appointed to Intel’s board of directors, effective immediately. Smith will serve as an independent director and join the board’s Audit & Finance Committee.
SemiQon Announces Shipping of its Silicon-Based 4-qubit Quantum Chip and Transistors
Research groups around the world are now using these first-generation silicon-based chips helping the industry step faster to the million qubit level of quantum computing.
Brooks Instrument Introduces New Mass Flow Controllers for High-Temperature Environments
Brooks Instrument has released its new GF120xHT Series high-temperature thermal mass flow controller.
Silicon Box Announces $3.6B Investment For Expansion Into Italy
Silicon Box cutting-edge, advanced panel-level packaging foundry announced its intention to collaborate with the Italian government to invest up to $3.6B (€3.2B) in Northern Italy, as the site of a new, state-of-the-art semiconductor assembly and test facility.
MICLEDI Microdisplays Secures Series A Funding
MICLEDI Microdisplays today announced a first closing of its Series A funding round with participation from imec.xpand, PMV, imec, KBC and SFPIM demonstrating strong support for the company’s value proposition and commercial and technological progress achieved in the seed round.
Micron Appoints Robert Swan to its Board of Directors
Micron Technology, Inc. today announced the appointment of Robert (Bob) Swan to its board of directors.
MRSI Introduces MRSI-A-L Active Aligner
MRSI Systems (a part of Mycronic Group), a manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, introduced the MRSI-A-L Active Aligner.
