National staffing company building new path forward to fill talent gaps for rapidly expanding industry.
Yield Engineering Systems Opens New Advanced Technology Center in Arizona to Support Semiconductor Growth in the US
Yield Engineering Systems (YES), a provider of technology solutions and process equipment for the semiconductor ecosystem and applications, held a ribbon-cutting ceremony today for its new 123,000-square-foot facility in Chandler, Arizona.
POET Technologies Announces Sample Availability of 100G LR4 Optical Engines and Testing with Three Lead Customers
POET Technologies Inc., the designer and developer of the POET Optical Interposer and Photonic Integrated Circuits (PICs) for the data center, telecommunication and artificial intelligence markets, today announced sample readiness of 100G LR4 Transmit and 100G LR4 Receive optical engines that are part of “POET Legacy” product family.
onsemi and Magna Sign Strategic Agreement, Invest in Silicon Carbide Manufacturing for Growing Electric Vehicle Market
Magna to integrate onsemi EliteSiC into its traction inverter solutions to improve range and efficiency of electric vehicles.
Enhanced Light Absorption in Thin Silicon Photodetectors with Photon-Trapping Structures
Researchers devise an approach to vastly enhance the near-infrared absorption in silicon, which could lead to affordable, high-performance photonic devices.
Materials “Sweet-spot” – ALD/CVD Precursor Supply Chain
Mo may replace HVM applications, which could reduce future WF6 supply strains.
Micron Delivers Industry’s Fastest, Highest-Capacity HBM to Advance Generative AI Innovation
Micron Technology, Inc. today announced it has begun sampling the industry’s first 8-high 24GB HBM3 Gen2 memory with bandwidth greater than 1.2TB/s and pin speed over 9.2Gb/s, which is up to a 50% improvement over currently shipping HBM3 solutions.
Department of Commerce and Department of Defense Sign Memorandum of Agreement to Strengthen U.S. Defense Industrial Base
The United States Departments of Commerce (DoC) and Defense (DoD) have signed a Memorandum of Agreement (MOA) to expand collaboration to strengthen the U.S. semiconductor defense industrial base.
Growing Colorado’s Semiconductor Industry: Polis Administration Capturing Federal CHIPS and Science Act Funding for Colorado Jobs and Economy
Today, Governor Polis and the Global Business Development Division of the Colorado Office of Economic Development & International Trade (OEDIT) announced the CHIPS Refundable Tax Credits Program to aid Colorado companies in securing federal funding available through the CHIPS and Science Act.
Tachyum Unveils Path to Sustainable Green Datacenters
Tachyum announced today the release of the white paper, “Tachyum Prodigy – Solution for Data Centers that are Hungry for Energy,” explaining how Prodigy, the world’s first Universal Processor, is ideally suited to help overcome increasingly excessive energy use in data centers.
