Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Ayar Labs Raises $130 Million in Series C Funding, Accelerating Commercialization of Industry’s First In-Package Optical I/O Products

Boardman Bay Capital Management leads round joined by strategic investments from industry bellwethers Hewlett Packard Enterprise and NVIDIA, fast-tracking Ayar Labs’ transformational technology for AI, HPC, cloud, and telecom applications.

ClassOne Equipment Introduces New Takano Particle Inspection Systems to Replace Outdated Legacy Tools

ClassOne Equipment has just introduced two new high-performance Takano particle inspection systems for ≤200mm and ≤300mm unpatterned wafers.

DENSO and USJC Collaborate on Automotive Power Semiconductors

DENSO Corporation and United Semiconductor Japan Co., Ltd. today announced that the companies have agreed to collaborate on the production of power semiconductors at USJC’s 300mm fab in order to serve the growing demand in the automotive market.

Advantest ACS Nexus Enables Real-time Data Analytics for Semiconductor Test

New ACS Nexus enables real-time data streaming from distributed test floors across the semiconductor supply chain for the analytics solutions of customers and third-parties.

BSE Wins Multiple Orders from Leading OSAT for Zeus Gravity Test Handler for Automotive IC Handling

Boston Semi Equipment, a global semiconductor test handler and test automation company, announced today that it has received multiple orders for its Zeus gravity test handler from a major outsourced semiconductor assembly and test (OSAT) customer.

FLEX Conference 2022 to Highlight Latest Flexible Hybrid Electronics Innovations

FLEX Conference will gather industry experts July 11-14, 2022, at the Moscone Center in San Francisco for keynotes, panel discussions, technical sessions and product-based demonstrations highlighting the latest innovations in flexible and printed electronics.

Imec Ramps Up the Development of the High-NA EUV Patterning Ecosystem

This week, at the 2022 SPIE Advanced Lithography and Patterning Conference, imec presents significant progress in preparing the High-NA patterning ecosystem for the imec-ASML Joint High-NA Lab.

Wafer Capacity Forecast to Climb 8.7% As 10 New Fabs Enter Production

Even with more fabs, strong unit growth will keep industry capacity utilization at 93.0% in 2022.

Taiwan to Control 48% of Global Foundry Capacity in 2022, Says TrendForce

According to TrendForce, Taiwan is crucial to the global semiconductor supply chain, accounting for a 26% market share of semiconductor revenue in 2021, ranking second in the world.

Denton Vacuum Announces New Order from Leading OLED Display Manufacturer

Denton Vacuum LLC today announced it has won a new system order for encapsulation from a leading North American OLED display manufacturer.