Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

MIRA XR: New Ultra-High-Resolution SEM-EDS Solution by TESCAN GROUP

TESCAN GROUP introduces the MIRA XR, an ultra-high-resolution SEM-EDS solution designed for fast, precise materials analysis in academic research and quality control environments.

Trymax Semiconductor Equipment B.V. Reaches 500 Process Chamber Installations in Asia

Milestone signals strong momentum towards 1,000 global systems by end-2025.

EV Group Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for Heterogeneous Integration to be Highlighted at ECTC 2025

The adoption of newer packaging technologies with tighter pitch requirements to support higher bandwidth needs for high-performance computing and AI applications are in turn fueling the need for new and different hybrid bonding techniques.

Gelest Completes New Production Facility

The company will celebrate the plant opening with an official ribbon cutting May 16.

Finwave Semiconductor Secures $8.2M in Funding

Finwave Semiconductor, Inc. today announced a new $8.2M bridge investment round, led by Fine Structure Ventures, Engine Ventures, and Safar Partners – with strategic participation from technology partner GlobalFoundries.

TechInsights Announces 2025 Global Semiconductor Supplier Award Winners

TechInsights, the authoritative information platform for the semiconductor industry, today released its 2025 Customer Satisfaction Survey along with the associated Global Semiconductor Supplier Award winners for the chip making equipment sector.

ClassOne Technology and IBM Research Jointly Developing
Non-NMP Solvent Processing for Semiconductor Manufacturing

ClassOne Technology and IBM Research today announced they have signed a joint development agreement focused on wet processing for advanced packaging.

Imec and Feinstein Unveil Novel Concept for Neuromodulation with Intermittent Interferential Current Stimulation

Imec and the Feinstein Institutes for Medical Research introduce a novel method for activating neural tissue using intermittent interferential current stimulation (i²CS).

centrotherm clean solutions Becomes Pfeiffer Vacuum+Fab Solutions

The Busch Group, one of the largest vacuum solution providers worldwide, announces that its brand centrotherm clean solutions will become part of Pfeiffer Vacuum+Fab Solutions.

POET Appoints Ghazi Chaoui, PhD, as Senior Vice President – Global Manufacturing and Digital Transformation

POET Technologies Inc. today announced the appointment of Ghazi M. Chaoui, PhD, MBA as its Senior Vice President of Global Manufacturing and Digital Transformation.