Valleytronics, based on the valley degree of freedom, is a promising candidate for next-generation information devices beyond traditional field-effect transistors.
SmartSens Selects PDF Solutions Exensio Fabless for Data Analytics of CMOS Image Sensors
PDF Solutions, Inc. (NASDAQ: PDFS), a global provider of differentiated data and analytics solutions to the semiconductor and electronics industries, today announced that SmartSens, a CMOS image sensor (CIS) semiconductor company, has selected Exensio Fabless as the platform to perform data management and analytics for their entire family of CIS products.
Intel’s Rebirth Could See it Become the US National Chip Champion, Says GlobalData
Following the publication of Intel’s Q4 and full-year 2021 financial results, analysts at GlobalData, a data and analytics company, give their comments on the results.
The Real Reason Behind the Automotive Industry IC Shortage — A Step-Function Surge in Demand
After years of moderate increases, IC suppliers blindsided by automotive IC demand spike in 2021.
SEMI Applauds House Introduction of America COMPETES Act of 2022 with Funding for CHIPS Act
SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the introduction of the America Competes Act of 2022 in the United States House of Representatives.
ACM Research Strengthens Wet Processing Portfolio with New Compound Semiconductor Tools
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today introduced its comprehensive tool set to support compound semiconductor manufacturing.
SRC and NSF to Support Semiconductor Research Experiences for Undergraduates
The U.S. National Science Foundation (NSF) and Semiconductor Research Corporation (SRC) recently signed a memorandum of understanding to support hands-on research opportunities for undergraduate students in technical areas related to semiconductors.
JEDEC Publishes HBM3 Update to High Bandwidth Memory (HBM) Standard
JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of the next version of its High Bandwidth Memory (HBM) DRAM standard.
NucleiSys Adopts Breker’s System Coherency TrekApp
Breker Verification Systems announced Nuclei System Technology deployed its System Coherency Synthesis TrekApp to ensure coherency of its configurable low-power and high-performance 32- and 64-bit RISC-V processor intellectual property (IP) designs.
SmartDV and NSITEXE Sign Agreement
SmartDV Technologies, a supplier of Design and Verification Intellectual Property (IP), and NSITEXE, developer of advanced processors, today signed a multi-year agreement that enables SmartDV to license NSITEXE’s recently announced RISC-V-based, 32-bit CPU core to its customers.
