Today KLA Corporation (NASDAQ: KLAC) announced two new products: the PWG5 wafer geometry system and the Surfscan SP7XP wafer defect inspection system. The new systems are designed to address exceedingly difficult issues in the manufacture of leading-edge memory and logic integrated circuits.
Advanced Energy Launches MAXstream RPS Product Line for Chamber Clean Applications
Advanced Energy announced the launch of its new MAXstream remote plasma source (RPS) product line for plasma cleaning of process chambers used in semiconductor device manufacturing.
Spin Memory Joins Semiconductor Industry Association as First MRAM-focused Member
Spin Memory, Inc. (Spin Memory), the leading developer of MRAM technologies, today announced that it is joining the Semiconductor Industry Association (SIA).
STMicroelectronics to be Carbon Neutral by 2027
STMicroelectronics announced its goal to become carbon neutral by 2027, the earliest date anticipated for any semiconductor company globally.
BrainChip Ships Akida Evaluation Boards
BrainChip Holdings Ltd, a provider of ultra-low power high performance artificial intelligence technology, today provides the following update on the on the shipment of the Company’s evaluation boards for the Akida Neuromophic System-on-Chip (NSoC).
The 2021 Predictions in Power Electronics
As 2020 comes to a close, we will undoubtedly look back on the past twelve months as a time in which disruption was the hallmark. Amid the unprecedented socioeconomic upheaval brought about by Covid-19, organizations have had to pivot and strategize, adapt and change in new ways – in a far more agile manner than at any time in history.
EV Group Unveils Hybrid Die-to-Wafer Bonding Activation Solution To Speed Up Deployment of 3D Heterogeneous Integration
EVG320 D2W die preparation and activation system provides seamless integration with
third-party die bonders; completes EVG’s equipment portfolio for end-to-end hybrid bonding
for 3D/Heterogeneous Integration
Data Sharing Across the Fab And the Cost of Inaction
By Alan Ifould Data collection and analysis, more specifically, turning data into useful information and actionable insight, is the necessary foundation for any progress toward the benefits promised by Smart Manufacturing and Industrie 4.0.
Pfeiffer Vacuum Presents New Turbopumps HiPace 350 and HiPace 450
With the HiPace 350 and 450, Pfeiffer Vacuum presents a turbopump especially dedicated for applications like mass spectrometry, electron-microscopy, metrology tools, particle accelerators and plasma physics. In addition to analytical, vacuum-process and semiconductor technology, their broad range of applications also includes coating, research & development and industrial applications.
Atomera Announces Availability of MSTcadfor Modeling Semiconductor Device Improvements with MST
Atomera Incorporated, a semiconductor materials and licensing company focused on deploying its proprietary silicon-proven technology, today announced immediate availability of MSTcadTM, Mears Silicon Technology computer-aided design, a powerful software tool showcasing the advantages of using MST in a variety of semiconductor devices.
