Busch Vacuum Solutions has now launched the COBRA NX 0950 A PLUS, the second vacuum pump in the new PLUS series. It is a dry, oil-free vacuum pump, which can run with pressure control or at a constant rotational speed, making it exceptionally energy-efficient.
Keysight Technologies Infiniium EXR-Series Offers Advanced Oscilloscope Technology via the Company’s Global Network of Distributors
Keysight Technologies, Inc., a technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced the new Infiniium 8-channel oscilloscope technology, which is now available via both distribution and direct channels.
STMicroelectronics Collaborates with Qualcomm Technologies on Unique Sensor Solutions for Next-Gen Mobile, Connected PC, IoT, and Wearable Applications
STMicroelectronics is extending its leadership in sensor technologies by developing innovative software solutions using technology from Qualcomm Technologies, Inc. through the Qualcomm Platform Solutions Ecosystem program.
Dialog Semiconductor Announces SLG47004 GreenPAK First Fully Programmable Advanced Analog System IC
Dialog Semiconductor plc(XETRA:DLG), a leading provider of battery and power management, Wi-Fi, Bluetooth low energy (BLE) and Industrial edge computing solutions, today announced the SLG47004, Dialog’s first Advanced Analog GreenPAK IC.
Mipsology and OKI Bring FPGA-driven Machine Learning (ML) Acceleration to Japanese Market
Machine learning (ML) software innovator Mipsology and design and development company OKI IDS Co., Ltd. (OKI IDS) signed an agreement on October 20 to join forces on hardware solutions for the Japanese high-speed image processing AI market.
3D-Micromac Unveils High-Throughput Selective Laser Annealing System for Magnetic Sensor Manufacturing
3D-Micromac AG today introduced the first industrial selective laser annealing system for magnetic sensor formation — the microVEGA xMR
2020 IEEE International Electron Devices Meeting (IEDM) Announces Virtual Events Schedule & Technical Highlights
The 66th annual edition of the IEEE International Electron Devices Meeting (IEDM), the world’s premier forum for the presentation of applied research in transistors and related devices, has announced the details of its virtual schedule.
DRAM Price Erosion Expected Through the End of 2020
Price jump that typically coincides with the introduction of new smartphone models in 3Q and 4Q is not expected due to disrupted buying patterns and cautious discretionary spending.
CEA-Leti to Present Latest Results & Insights on 3D Technologies, Power Electronics & Quantum Computing at IEDM 2020
CEA-Leti will unveil its latest scientific results in 3D sequential integration for neural networks, 3D RRAM for in-memory computing and GaN-on-Si for power electronics at IEDM 2020, Dec. 12-16. The event will be held virtually because of the coronavirus pandemic.
Water Predictions: Telling When a Nanolithography Mold Will Break Through Droplets
Ultraviolet nanoimprint lithography (UV-NIL) is a manufacturing technique for producing nanostructures using UV-curable resin.
