Carica Sustainable Investments announced today a strategic investment to propel the development of SemiLink Materials, a United States-based semiconductor materials manufacturer and distributor serving the domestic semiconductor manufacturing industry.
Larg Weiland of PDF Solutions Wins Si2 Pinnacle Award
Larg Weiland, a technical fellow at PDF Solutions, has been honored with the quarterly Silicon Integration Initiative Pinnacle Award, which is presented for exceptional contributions to Si2’s success as a leading semiconductor research and development joint venture.
Imec.xpand Launches EUR 300M Fund Amid Global Race for Semiconductor Supremacy
Imec.xpand, an independent global venture capital fund, today announced the launch of a new EUR 300 million fund aimed at accelerating the growth of transformative semiconductor and nanotechnology innovations.
Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU
Synopsys, Inc. today announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry’s latest Gate-All-Around (GAA) process technologies.
mechatronic systemtechnik GmbH Unveils Technology Center in Fürnitz
mechatronic systemtechnik GmbH (mechatronic), a global supplier of automation equipment for critical wafer handling, announced the opening of its new cutting-edge technology center in Fürnitz.
Semiconductor CMP Pad & Slurry Forecast
CMP consumables for metals to see large growth over next 5 years.
The Flipping Future: Advancements in Flip Chip Packaging
Flip chip technology makes it possible to replace conventional wire interconnections with a direct and strong bond between chips and substrates. The future of silicon packaging is anticipated to be significantly influenced by flip chip technology to satisfy the increasing need for electronics that are faster, smaller, and more efficient.
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
Research published in Nature demonstrates high qubit control fidelity and uniformity in single-electron control.
Purdue-Created Technology Makes 3D Microscopes Easier to Use, Less Expensive to Manufacture
3D microscopes are used in applications from the life sciences to semiconductor manufacturing. Now Purdue engineers are developing patented and patent-pending innovations making them work faster to capture even more 3D images and less expensive to manufacture.
Rogue Valley Microdevices’ Unveils 300mm MEMS Capability at its Upcoming Palm Bay, Florida Facility
CEO Jessica Gomez presents this week at the MEMS & Sensors Technical Congress.
