The SEMI Silicon Photonics Industry Alliance (SiPhIA) held the Bridging Light & Silicon: SEMI SiPhIA SIGs Kick-off & Seminar today, announcing the official launch of three Special Interest Groups (SIGs) aimed at integrating expertise from various sectors to formulate industry standards and accelerate technological innovation and commercialization.
STMicroelectronics Details Company-Wide Program to Reshape Manufacturing Footprint
STMicroelectronics today disclosed further elements of its program to reshape its global manufacturing footprint.
Accelsius Achieves Industry-Leading Thermal Milestones for Next-Generation AI Computing
Accelsius announced two major thermal testing milestones today, demonstrating the unmatched performance and scalability of its proprietary two-phase, direct-to-chip NeuCool solution.
IEEE Study Leverages Silicon Photonics for Scalable and Sustainable AI Hardware
Researchers have developed a new hardware platform for AI accelerators capable of handling significant workloads with reduced energy requirement.
Global Semiconductor Equipment Billings Surged to $117 Billion in 2024, SEMI Reports
Worldwide sales of semiconductor manufacturing equipment increased 10% to $117.1 billion in 2024 from $106.3 billion in 2023, SEMI, the industry association representing the global electronics design and manufacturing supply chain, reported today.
Czech Semiconductor Centre Launches in Brno, Strengthening Europe’s Chip Autonomy
A new chapter in Europe’s semiconductor independence has begun in Brno with the launch of the Czech Semiconductor Centre (CSC).
From Microelectronics to Microfluidics: How 3D Printing Is Shaping the Future of Tiny Devices
The world of micro and nano devices is undergoing a seismic shift, thanks to the latest advancements in 3D printing technology.
Computing Breakthrough Award Goes to Key Figure in Microchip Revolution
UCLA Professor Jason Cong recognized with the ACM Chuck Thacker Award for Improving the Automation and Customizability of Computing Systems.
FormFactor Introduces the EVOLVITY 300 Probe System
Company expands the 300mm product line with new semi-automated system.
Nexperia Introduces New High Speed Optimized Flip-Chip Package Technology
New flip-chip land grid array (FC-LGA) packages deliver superior RF performance and meet automotive quality with industry’s first side-wettable flank versions.
