Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Biden-Harris Administration Making Progress One-Year into CHIPS for America

This week marked the one-year anniversary of President Biden signing the bipartisan CHIPS and Science Act into law as part of his investing in America agenda.

One Year After Enactment, CHIPS & Science Act is on Path to Success; Work Remains to Maximize Impact

Semiconductor Industry Association (SIA) President and CEO John Neuffer today released the following statement regarding the one-year anniversary of enactment of the CHIPS and Science Act, a landmark law that provides $52 billion for semiconductor manufacturing incentives and research initiatives.

Simple Ballpoint Pen Can Write Custom LEDs

Researchers have developed ink pens that allow individuals to handwrite flexible, stretchable optoelectronic devices on everyday materials including paper, textiles, rubber, plastics and 3D objects.

IDTechEx Discusses Next-Generation RDL Materials in Advanced Semiconductor Packaging

With the ever-increasing demand for higher performance and efficiency in electronic devices, the semiconductor industry is constantly pushing the boundaries of packaging technology.

Nordson’s Semiconductor Advanced Packaging Solutions Will Be Demonstrated at SEMICON Taiwan 2023

Nordson Electronics Solutions will demonstrate the latest solutions for semiconductor advanced packaging at the SEMICON Taiwan tradeshow booth L0800, Hall 1, 4th floor.

TSMC to Build Multi-Billion-Euro Chip Factory in Germany

Taiwanese semiconductor manufacturer TSMC plans to construct a massive new production facility in the eastern German city of Dresden.

NEO Semiconductor 3D X-DRAM Awarded “Best of Show” for Most Innovative Memory Technology

NEO Semiconductor, a developer of innovative technologies for 3D NAND flash and DRAM memory, today announced that its ground-breaking technology, 3D X-DRAM, captured the top prize at Flash Memory Summit 2023, winning the “Best of Show” award for the Most Innovative Memory Technology.

Researchers Discover a Potential Application of Unwanted Electronic Noise in Semiconductors

Random telegraph noises in vanadium-doped tungsten diselenide can be tuned with voltage polarity.

Membrion Series B Round Closes at $12.5M

Samsung Ventures and Lam Capital invest in Membrion sustainable solutions for industrial and semiconductor wastewater.

Governor Hochul Announces the Establishment of World-Class AMD Design Centers in New York State

High-performance semiconductor design company commits to creating 165 new jobs in two New York State locations.