Nordson’s Semiconductor Advanced Packaging Solutions Will Be Demonstrated at SEMICON Taiwan 2023

Nordson Electronics Solutions will demonstrate the latest solutions for semiconductor advanced packaging at the SEMICON Taiwan tradeshow booth L0800, Hall 1, 4^th floor. At the booth, you will see these systems:

• The popular ASYMTEK Vantage fluid dispensing system. Nordson’s most advanced dispensing platform, is designed for high-end semiconductor packaging and assembly. Fast and accurate, the Vantage, when configured with dual IntelliJet valves, can jet into gaps less than 200 um, and up to 90,000 dots per hour.
• The newest ASYMTEK Forte fluid dispensing system offers exceptional dispensing productivity and accuracy for high-volume consumer electronics, flexible circuit, MEMs, and electromechanical applications.
• Both systems offer fine-line dispensing capabilities to meet requirements for underfill, gap fill, sealing lines for fan-out/fan-in, strips, and module assembly.

Experts will be ready to discuss how Nordson can support your operations for reliable electronic products. SEMICON Taiwan will be held at Taipei Nangang Exhibition Center, Taipei Taiwan, September 6-8, 2023.