Collaboration along the supply chain, focused on common issues that emerge out of the dynamic electronics market and changing automotive ecosystem, will identify and drive improvements in the interest of the whole supply chain.
Mitigation of Pattern Collapse in EUVL
Rinse materials offer benefits of pattern collapse mitigation and defect improvement and, therefore, superior process margins for yield improvement. Defectivity is also significantly improved with an EUV rinse.
Intel 144-Tier Three-deck FG NAND with 161 Total Gates
A new 3D QLC NAND product has just arrived. TechInsights has quickly reviewed the Intel 1Tb QLC die removed from SSD 670p series which use 144L 3D NAND devices.
2021 Electronic Gas Market to Reach $6.25B up 7%+
The total electronic gas market will reach $6.25B for 2021, more than 7% above 2020 revenues. Over the next several years, steady growth is expected thanks to growing demand for chips and fab expansions worldwide.
The Chip Shortage Wake-up Call
An extreme hypothetical scenario of complete disruption of Taiwanese foundries for one year could cause the global electronics supply chain to come to a halt.
Accelerating AI-Defined Cars
Expect to see a convergence of edge computing, machine vision and 5G-connected vehicles.
IBM Unveils World’s First 2 nm Chip Technology
IBM announced a breakthrough in semiconductor design and process with the development of the world’s first chip announced with 2 nm nanosheet technology. The new design is projected to achieve 45 percent higher performance and 75 percent lower energy use than today’s 7 nm chips. It will likely not be in production until 2024.
Multilayer Thickness Evaluation of Semiconductor and Display Structures by Picosecond Ultrasonics
The product line JAX designed by Neta uses unique properties of femtosecond pulses and photo-acoustic effects to inspect thin films stacks. This 100% non-destructive optical method can be used to test and control multilayers which are typical from applications in the semiconductor or in the display industries.
LiDAR Laser Circuit Optimization and Measurement
A method of measurement is described that provides the necessary feedback to correctly evaluate laser diode and driver performance and changes in spectral response with temperature simultaneously.
Mid-Infrared Optical Metrology for High Aspect Ratio Holes in 3D NAND Manufacturing
Infrared critical dimension metrology (IRCD) addresses the shortcomings of conventional ultraviolet to near-infrared OCD in channel hole etch high-fidelity z-profile and amorphous carbon hardmask etch BCD metrology.
