The latest ITRS highlights 3D power scaling, system level integration and a new chapter on big data.
IITC: New Materials for Advanced Interconnects
The 17th annual International Interconnect Technology Conference (IITC) will be held May 21 – 23, 2014 in conjunction with the 31st Advanced Metallization Conference (AMC) at the Doubletree Hotel in San Jose, California.
Extreme Stress for Existing Foundry/Fabless Model
The increased performance and the rapid shift from traditional handsets to consumer computing device post a number of manufacturing and supply chain challenges for fabless chip makers. The scale of the challenges also creates an “extreme stress” for the existing foundry/fabless model to defend its excellence in this dynamic landscape. Qualcomm’s Dr. Roawen Chen will discuss headwinds and opportunities in a keynote talk at The ConFab.
At The ConFab 2014: The Outlook for the Semiconductor Industry
The semiconductor market will continue at a steady growth rate for the next several years. For a semiconductor company to achieve significant growth in this ultra-competitive environment, it needs to identify market opportunities and predict the future, in terms of…
The ConFab R&D Panel is Set
A panel session at The ConFab, to be held June 22-25 in Las Vegas, will focus on how the semiconductor industry can continue to innovate in an environment where lower revenue growth is combined with rising development costs and consolidation.
Webcast on 3D Integration/Advanced Packaging, Lithography
If you’ve been following the field of 3D integration for any time at all, then you’re familiar with Sitaram Arkalgud. He’ll be presenting on Thursday for a Solid State Technology webcast.
Qualcomm’s Dr. Roawen Chen to keynote at The ConFab
I’m delighted to report that Dr. Roawen Chen, Senior Vice Present of global operations at Qualcomm, has accepted our invitation to deliver the keynote talk at The ConFab, on Monday June 23rd.
Dr. Gary Patton to provide keynote at The ConFab
Dr. Gary Patton will provide the keynote talk at The ConFab on Tuesday, June 24th. Gary is Vice President of IBM’s Semiconductor Research and Development Center in East Fishkill, New York
Mission accomplished. Now what?
I haven’t toasted to cheap silicon for a while. Why? Because that mission has been accomplished.
Take the NCMS survey, but first figure out your nano position
I recommend taking the new survey out by the National Center for Manufacturing Sciences (NCMS) but you may first want to give some thought as to what is and what isn’t “nanotechnology.”
