Experts at BrainChip offered new insights and considerations for the use of transfer learning and incremental learning in edge AI/IoT environments.
AI
Singapore’s Five Research Pillars Outlined at SEMICON Southeast Asia
At SEMICON Southeast Asia 2021, Mr. Terence Gan, SVP, Semiconductors, Economic Development Board (EDB) of Singapore, outlined five research pillars.
IBM Unveils On-Chip Accelerated Artificial Intelligence Processor
At the annual Hot Chips conference, IBM unveiled details of the upcoming new IBM Telum Processor, designed to bring deep learning inference to enterprise workloads to help address fraud in real-time.
SEMICON Southeast Asia 2021 Goes Virtual Next Week with 5G in Focus
Opening next week as a virtual conference and exhibition, SEMICON Southeast Asia (SEMICON SEA) 2021, the region’s premier event for the global electronics manufacturing and design supply chain, will gather industry experts from around the world for insights into the latest semiconductor ecosystem developments and trends with a focus on 5G, a key industry growth driver.
SEMICON Taiwan 2021 Rescheduled to Dec. 28-30 with 3-Month Experience Set to Begin in September
Semiconductor leaders and visionaries will gather to provide insights into the latest industry developments and innovations during a three-monthSEMICON Taiwan 2021 experience starting with five live online forums in September and culminating in the on-site exhibition December 28-30 at the Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1).
BrainChip Receives Akida Chips from Socionext America
BrainChip Holdings Ltd, a provider of ultra-low power high performance artificial intelligence technology, today announced it has received the first batch of Akida chips from its manufacturing run from Socionext America (SNA).
The New Reality: Opportunities in Augmented Reality to Explode in Coming Years
Lux Research foresees innovations and advancements that will drive smart glasses adoption in as little as two years and fully immersive AR glasses in as little as five years.
Motivo, Inc. Raises $12 Million Series A to Accelerate AI-Enabled Chip Design and Improve Manufacturing Yields
Motivo, Inc., developer of AI-enabled chip design and data analytics solutions, today announced it raised a $12 million Series A financing round led by Intel Capital, along with other new investors Storm Ventures and Seraph Group as well as participation from Inventus Capital and other existing investors that include multiple IC industry C-suite executives.
With AI, Your Car Can Detect Potholes
The Korea Institute of Civil Engineering and Building Technology (KICT) has announced the development of an ‘AI-based automatic pothole detection system’.
Overcoming the Limitations of Scanning Electron Microscopy with AI
A joint research team from POSTECH and the Korea Institute of Materials Science (KIMS) applied deep learning to the scanning electron microscopy (SEM) to develop a super-resolution imaging technique that can convert a low-resolution electron backscattering diffraction (EBSD) microstructure images obtained from conventional analysis equipment into super-resolution images.
