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AI
Atonarp Announces New Metrology Platform Aston
Atonarp, a manufacturer of molecular sensing and diagnostics products for the semiconductor, healthcare, and pharma industries, today announced Aston, an in-situ semiconductor metrology platform with an integrated plasma ionization source.
Canaan Releases Self-developed Edge AI Chip, the Kendryte K510
Canaan Inc., a high-performance computing solutions provider, today announced the release of the Kendryte K510, an independently designed and developed RISC-V based edge AI chip, at the 2021 World Artificial Intelligence Conference.
Winbond HyperRAM & SpiStack and Renesas RZ/A2M Accelerate the Construction of Embedded AI Systems
Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, announced today the official confirmation that its HyperRAM and SpiStack (NOR+NAND) can be operated with Renesas’ RZ/A2M Arm-based microprocessors (MPUs).
Renesas’ New Modular IoT Development Platform Dramatically Reduces Time-to-Market and Design Complexity
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today introduced an innovative new IoT system design platform that significantly eases the prototyping of IoT systems.
Mouser Electronics Explores the Power Behind AI at the Edge in Next 2021 Empowering Innovation Together Installment
Mouser Electronics Inc. today releases the third installment of the 2021 series of its award-winning Empowering Innovation Together program.
Taiwanese Ministry of Economic Affairs (MOEA) Officially Approves Kneron’s Acquisition of Vatics
Kneron, a San Diego-based AI chip and software developer, today announces the approval of its acquisition of Vatics by the Taiwanese Ministry of Economic Affairs (MOEA).
STMicroelectronics Collaborates with Eyeris on Integration of Global-Shutter Sensor Solution for Automotive In-Cabin Monitoring
STMicroelectronics today announced a cooperation with Eyeris, a developer of vision-based Artificial Intelligence (AI) software and in-cabin sensor fusion technologies.
Blaize and eYs3D Microelectronics Unveil New Reference Design for Enhanced 3D Computer Vision for Edge AI
Blaize and eYs3D Microelectronics today announced a reference design for the Blaize Pathfinder P1600 SoM (system on a module).
A More Robust Memory Device for AI Systems
A research team from Northwestern Engineering and the University of Messina in Italy have developed a new magnetic memory device that could lead to faster, more robust Artificial Intelligence (AI) systems.
