AI

Intel Commits $50M with Pandemic Response Initiative to Combat Coronavirus

Today, Intel is pledging an additional $50 million in a pandemic response technology initiative to combat the coronavirus through accelerating access to technology at the point of patient care, speeding scientific research and ensuring access to online learning for students.

Revenue Management Challenges Cost High Tech Companies Billions, According to New Model N Research

Model N, Inc. (NYSE: MODN), the leader in cloud revenue management solutions, today announced details of a new executive report, the “2020 State of Revenue,” created to examine revenue management trends in the high tech industry.

Si2 Launches Survey on Artificial Intelligence and Machine Learning in EDA

Silicon Integration Initiative has launched an industry-wide survey to identify planned usage and structural gaps for prioritizing and implementing artificial intelligence and machine learning in semiconductor electronic design automation.

Untwisting Plastics for Charging Internet-of-Things Devices

Untwisting chains of atoms within a plastic polymer improves its ability to conduct electricity, according to a report by researchers, led by Nagoya University applied physicist Hisaaki Tanaka, in the journal Science Advances. The insight could help accelerate the development of wearable power sources for a vast number of Internet-of-things devices.

OnScale Launches Project BreathEasy: Digital Twins of Lungs to Improve COVID-19 Patients Outcomes

OnScale, the leader in Cloud Engineering Simulation, announces Project BreathEasy, a consortium of multiphysics FEA/CFD vendors, medical device manufacturers, engineers, and doctors from around the world who are developing digital twins of the lungs of COVID-19 patients to help doctors improve patient outcomes and optimize use of limited ventilator resources in major outbreak areas.

The 2020 Symposia on VLSI Technology & Circuits Goes Virtual

For the first time in its 40-year history, the 2020 Symposia on VLSI Technology & Circuits will be held as a virtual conference due to concerns over the global coronavirus (COVID-19) pandemic.

Groq Adopts Synopsys ZeBu Server 4 to Develop Breakthrough AI Chip

Synopsys, Inc. (Nasdaq: SNPS) today announced that Groq has adopted the Synopsys ZeBu® Server 4 emulation solution for its Tensor Streaming Processor (TSP) architecture development. ZeBu Server 4 performance and capacity enabled first silicon success of Groq’s TSP architecture for artificial intelligence (AI) and machine learning platforms. ZeBu also enabled optimization and validation of Groq’s TSP architecture prior to silicon, resulting in unmatched performance for throughput and latency.

Samsung To Support U.S. Communities in the Fight Against COVID-19

Today, Samsung announced a community outreach donation of $4.3 million in COVID-19 relief to local partners in neighborhoods where a majority of their U.S. employees live and work. These donations build upon their global efforts to date, which now surpass $33 million.

BrainChip Announces Wafer Fabrication of the Akida System-on-Chip

BrainChip Holdings Ltd (ASX: BRN), a leading provider of ultra-low power, high performance AI technology announced that the Company and Socionext Inc., it’s development, manufacturing and commercial partner, have provided its wafer fabrication partner, TSMC, with the completed Akida design files and the MultiProject Wafer (MPW) is scheduled to commence fabrication on 8 April 2020. Given the accelerated processing time for MPW wafers, engineering samples of the Akida device are expected to be available in the third quarter of 2020.

NXP’s New Wi-Fi 6 Portfolio Accelerates its Large-Scale Adoption Across IoT, Auto, Access and Industrial Markets

NXP Semiconductors N.V. today announced the availability of a comprehensive Wi-Fi 6 (802.11ax) portfolio, which significantly expands the number of products and markets able to adopt the latest Wi-Fi standards. NXP’s expanded Wi-Fi 6 portfolio represents the company’s new end-to-end vision and differentiated technology approach that is designed to help usher in an era of connectivity innovation for automotive, access, mobile and Industrial and IoT markets.

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