AI

Blaize Emerges from Stealth to Transform AI Computing

Blaizeä today emerged from stealth and unveiled a groundbreaking next-generation computing architecture that precisely meets the demands and complexity of new computational workloads found in artificial intelligence (AI) applications. Driven by advances in energy efficiency, flexibility, and usability, Blaize products enable a range of existing and new AI use cases in the automotive, smart vision, and enterprise computing segments, where the company is engaged with early access customers. These AI systems markets are projected to grow rapidly* as the disrupting influence of AI transforms entire industries and AI functionality becomes a “must-have” requirement for new products.

SEMICON Europa Opens with SMART Mobility, MedTech, Design and Talent in Spotlight

SEMICON Europa, Europe’s largest event connecting the entire electronics design and manufacturing supply chain – from innovation to applications – opens today in strategic co-location with productronica at Messe München, in Munich, Germany. Themed Semiconductors Drive Smart, SEMICON Europa 2019 – Nov. 12-15 – highlights the vital importance of European sectors and ecosystems in propelling the semiconductor manufacturing industry and the broader electronics design and manufacturing supply chain worldwide.

On the Way to Intelligent Microrobots

Researchers at the Paul Scherrer Institute PSI and ETH Zurich have developed a micromachine that can perform different actions. First nanomagnets in the components of the microrobots are magnetically programmed and then the various movements are controlled by magnetic fields. Such machines, which are only a few tens of micrometres across, could be used, for example, in the human body to perform small operations. The researchers have now published their results in the scientific journal Nature.

GLOBALFOUNDRIES and SiFive to Deliver Next Level of High Bandwidth Memory on 12LP Platform for AI Applications

GLOBALFOUNDRIES® (GF®) and SiFive, Inc. announced today at GLOBALFOUNDRIES Technology Conference (GTC) in Taiwan that they are working to extend high DRAM performance levels with High Bandwidth Memory (HBM2E) on GF’s recently announced 12LP+ FinFET solution, with 2.5D packaging design services to enable fast time-to-market for Artificial Intelligence (AI) applications. In order to achieve the capacity and bandwidth for data-intensive AI training applications, system designers are challenged with squeezing more bandwidth into a smaller area while maintaining a reasonable power profile.

National Labs, Georgia Tech, Collaborate on AI Research

The Georgia Institute of Technology, Sandia National Laboratories, and the Pacific Northwest National Laboratory are jointly launching a new research center to solve some of the most challenging problems in artificial intelligence (AI) today, thanks to $5.5 million in funding from the U.S. Department of Energy (DoE). The new co-design center, known as the Center for ARtificial Intelligence-focused Architectures and Algorithms (ARIAA), funded by DoE’s Office of Science, will promote collaboration between scientists at the three organizations as they develop core technologies important for the application of AI to DoE mission priorities, such as cybersecurity, electric grid resilience, graph analytics, and scientific simulations.

China GDP and PMI Contraction A Risk Factor For Global Economy

IC Insights recently released its October Update to The McClean Report 2019. Part of the update reviewed U.S. and China GDP and PMI trends in light of the current trade friction between the two nations.

Award-winning Lattice sensAI Solutions Stack Further Extends Lead in Ultra Low-power AI at the Edge

Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced availability of performance enhancements and new and improved application reference designs for its award-winning sensAI™ solutions stack. sensAI helps OEMs develop AI and ML experiences for next-generation smart devices with power consumption measured in milliwatts.

NVIDIA Leads the Fast-Growing and Complex Edge AI Chipset Market but Competition is Intensifying

Diversity is the name of the game when it comes to the edge Artificial Intelligence (AI) chipset industry. In 2019, the AI industry is witnessing the continual migration of AI workloads, particularly AI inference, to edge devices, including on-premise servers, gateways, and end-devices and sensors. Based on the AI development in 17 vertical markets, ABI Research, a global tech market advisory firm, estimates that the edge AI chipset market will grow from US$2.6 billion in 2019 to US$7.6 billion by 2024, with no vendor commanding more than 40% of the market. The frontrunner of this market is NVIDIA, with a 39% revenue share in the first half of 2019. The GPU vendor has a strong presence in key AI verticals that are currently leading in AI deployments, such as automotive, camera systems, robotics, and smart manufacturing.

2019 Microprocessor Slump Snaps Nine Years of Record Sales

The microprocessor market’s string of nine straight record-high annual sales between 2010 and 2018 is expected to end this year with worldwide MPU revenue dropping 4% to about $77.3 billion because of weakness in smartphone shipments, excess inventories in data center computers, and the global fallout from the U.S.-China trade war, according to IC Insights’ recently updated forecast.

Lenovo and Intel Power Computational Research at the Flatiron Institute

Lenovo and Intel today revealed how their collaboration on joint technology solutions that accelerate the convergence of high-performance computing (HPC) and artificial intelligence (AI) is helping scientists at the Flatiron Institute solve scientific challenges in entirely new ways. The Flatiron Institute, located in New York City, is the internal research division of the Simons Foundation, whose mission is to advance the frontiers of research in mathematics and the basic sciences. Flatiron’s Scientific Computing Core supports scientific work there across four disciplines, requiring an HPC infrastructure to handle a variety of extremely large data files, from giant genomic sequencing files to 100,000 small files in a single directory.

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