Himax Technologies, Inc., a supplier and fabless manufacturer of display drivers and other semiconductor products, today announced its strategic investment in Obsidian Sensors, Inc., a San Diego-based thermal imaging sensor solution manufacturer.
Design
SEMIFIVE Signs MOU with Atron Technologies
SEMIFIVE, a design solution provider and pioneer of platform-based custom silicon solutions, has announced its agreement of MOU with China-based Atron Technologies, on May 23, 2024.
Alpha and Omega Semiconductor Introduces Half-Bridge MOSFET for DC-DC Applications
By reducing the footprint size to enable a more efficient high-power design, the AONG36322 XSPairFET provides a leading solution for space-constrained DC-DC Buck applications.
Lattice Introduces Advanced 3D Sensor Fusion Reference Design for Autonomous Applications
Lattice Semiconductor, the low power programmable leader, today announced a new 3D sensor fusion reference design to accelerate advanced autonomous application development.
ROHM Semiconductor and Nanjing SemiDrive Technology Jointly Develop a Reference Design
ROHM Semiconductor and Nanjing SemiDrive Technology Ltd., China’s largest SoC manufacturer for smart cockpits, today announced they have jointly developed a smart cockpit reference design.
Mobix Labs Completes Acquisition of RaGE Systems
RaGE Systems specializes in developing products for 5G communications, mmWave imaging, and Software Defined Radio systems targeting commercial, industrial, defense, and aerospace sectors.
Teradyne Marks 8,000th J750 Semiconductor Test System Shipment
Milestone achieved with V-Test, an independent third-party integrated circuit testing service company.
SEMICON West 2024 to Spotlight U.S. Chip Industry Investments, Supply Chain Resilience, Talent, and Global Growth and Innovation
SEMICON West 2024 will gather industry experts and leaders July 9-11 at the Moscone Center in San Francisco for insights into the latest trends and innovations in sustainability, supply chain management, workforce development and other critical industry issues.
Chips Industry May Not Be Fit For Purpose By 2030, Says GlobalData
Next-generation chips represent the next frontier of semiconductor technology, incorporating advancements in design, materials, manufacturing process, performance, and packaging. As computing tasks become more demanding and data-intensive, next-generation chips promise faster speeds and better energy efficiency.
POET Announces Design Win and Collaboration with Foxconn Interconnect Technology
POET and FIT have entered into a collaboration to develop 800G and 1.6T pluggable optical transceiver modules using POET optical engines with an aim to address the growth in demand from cutting-edge AI applications and high-speed data center networks.
