SEMI today announced that its International Board of Directors has elected Dr. Tien Wu, CEO of Advanced Semiconductor Engineering, Inc. (ASE), as its new chair, and Benjamin Loh, Chair of Comet AG, as its new vice chair, effective immediately, in accordance with the association’s by-laws.
Design
USTC Develops Weakly Space-Confined All-Inorganic Perovskite Light-Emitting Diodes
Researchers increased the brightness of perovskite LEDs (PeLEDs) to over 1.16 million nits and extended their lifespan to more than 180,000 hours.
Cadence Advances Design and Engineering for Europe’s Manufacturers on NVIDIA Industrial AI Cloud
At NVIDIA GTC Paris, Cadence announced it is providing optimized solutions for the world’s first industrial AI cloud in collaboration with NVIDIA.
Roll-to-Roll Technologies for Flexible Devices Set to Grow at 11.5% CAGR
According to the latest study from BCC Research, the “Global Markets for Roll-to-Roll Technologies for Flexible Devices” is expected to reach $69.8 billion by the end of 2029 at a compound annual growth rate (CAGR) of 11.5% from 2024 to 2029.
Micron Ships HBM4 to Key Customers to Power Next-Gen AI Platforms
The importance of high-performance memory has never been greater, fueled by its crucial role in supporting the growing demands of AI training and inference workloads in data centers.
How Edge AI Is Redefining What’s Possible in Semiconductor Design
AI is no longer confined to the cloud. Real-time decision-making, bandwidth limitations, and privacy concerns have driven the demand for edge AI—where computations occur locally on the device rather than being sent to centralized data centers.
TECHCET Forecasts $6.3B Electronic Gases Market in 2025
As chipmakers ramp production for AI, 5G, and advanced logic nodes, TECHCET announces the global electronic gas market will grow by 4.8% year-over-year in 2025 to reach $6.34 billion.
Alchip Technologies Broadens Global Design Capabilities
Alchip Technologies is expanding its global engineering footprint with the launch of new design centers in Vietnam and the expansion of its Japan Design Center.
What’s in the June Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the June issue.
Alphawave Semi Tapes Out Breakthrough 36G UCIe IP on TSMC 2nm
Alphawave Semi announced the successful tape out of one of the industry’s first UCIe IP subsystem on TSMC’s N2 process, supporting 36G die-to-die data rates.
