Design combines the best of digital and analog computing and delivers >10x energy efficiency.
Design
Advancing Toward Wearable Stretchable Electronics
Researchers at Stanford have been working on skin-like, stretchable electronic devices for over a decade.
Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
Cadence Design Systems, Inc. today announced a collaboration with Arm to deliver a chiplet-based reference design and software development platform to accelerate software-defined vehicle (SDV) innovation.
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.
SEMI ISS Europe 2024 Opens Tomorrow
Registration is open for the March 6-8 executive conference.
Nomination Period for Phil Kaufman Award and Hall of Fame Open Through June 30
The Phil Kaufman award recognizes individuals whose contributions made significant impacts to electronic system design (ESD) in technology innovation, business, industry direction, education or mentoring.
New Si2 Open Model Interface Provides Standard for Advanced SPICE Capabilities
The Silicon Integration Initiative Compact Model Coalition has released a new version of the Open Model Interface, an Si2 standard, C-language application programming interface that supports SPICE compact model extensions.
Accellera Systems Initiative Honors Shalom Bresticker with First Distinguished Service Award
Accellera Systems Initiative (Accellera) announced today that Shalom Bresticker, a longtime friend and contributor to Accellera standards efforts, is honored with the first Distinguished Service Award.
EU Consortium Developing Next-Gen Edge-AI Technologies Is Accepting Design Proposals
A new European Union consortium created to accelerate the development of next-generation, edge-AI technologies is installing cleanroom tools and gearing up to design, evaluate, test and fabricate new circuits from across Europe.
Intel Foundry Expands Support for Ansys Multiphysics Signoff Solutions with Intel 18A Process Technology
Intel Foundry certified Ansys (NASDAQ: ANSS) multiphysics solutions for signoff verification of advanced integrated circuits (ICs) designed with the Intel 18A process technology with new RibbonFET transistor technology and backside power delivery.
