Design

Renesas’ New Ultra-High Performance MCUs are Industry’s First Based on Arm Cortex-M85 Processor

This level of performance will allow system designers to use the RA MCUs in applications that previously required microprocessors (MPUs).

Breakthrough Synthesis Method Improves Solar Cell Stability

Dynamic crystallization control in Rice-led study solves 2D halide perovskite synthesis bottleneck.

Swave Photonics Welcomes Dr. Edward Buckley as Vice President, Augmented Reality Solutions

Swave Photonics announces the appointment of Dr. Edward Buckley as Vice President, Augmented Reality Solutions.

Introducing Lam’s VizGlow 3.0 Software

Lam’s VizGlow multi-physics plasma simulation software provides chipmakers a compelling alternative that can dramatically reduce material costs of experiments, speed up development, and shorten time to market.

Dr. Rick Tsai to Receive Global Semiconductor Alliance’s Highest Honor, the Dr. Morris Chang Exemplary Leadership Award

Global Semiconductor Alliance (GSA) proudly announces it will honor Dr. Rick (Lih Shyng) Tsai, the CEO and Vice Chairman of MediaTek with its prestigious Dr. Morris Chang Exemplary Leadership Award at this year’s Annual Awards Celebration on December 7, 2023.

Dukosi and Suzhou Hengmei Electron Technology Strengthen Partnership and Establish Joint Development Laboratory

Dukosi Ltd, the technology company revolutionizing the performance, safety and sustainability of battery systems, and Suzhou Hengmei Electron Technology, Inc. today announced the Joint Development Laboratory at Hengmei’s facility in Suzhou, China.

SEMICON Europa 2023 to Highlight Chip Industry Investments, Sustainability and Talent Strategies to Shape $1 Trillion Era

The event, Europe’s premier exhibition and conference for the microelectronics supply chain, will feature keynotes from the electronics design and manufacturing ecosystem, academia and government.

KYOCERA AVX Provided Key Components for the Historic Chandrayaan-3 Lunar Mission

KYOCERA AVX contributed several components to the Pragyaan lunar rover, including stacked TCH Series surface-mount capacitors that became the first polymer capacitors to ever be used in a space mission.

Ansys Receives Four TSMC 2023 OIP Partner of the Year Awards for Joint Development of Leading Multiphysics Technology and Design Solutions

Ansys has been recognized by TSMC as a recipient of four TSMC Open Innovation Platform (OIP) Partner of the year awards for 2023.

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