A team of researchers at the University of Massachusetts Amherst and the Georgia Institute of Technology has 3D printed a dual-phase, nanostructured high-entropy alloy that exceeds the strength and ductility of other state-of-the-art additively manufactured materials, which could lead to higher-performance components for applications in aerospace, medicine, energy and transportation.
Design
US CHIPS ACT Now Approved by President Biden – What’s Next?
Yesterday, President Biden signed the long-awaited CHIPs Act into law. So, “what’s next” for the US semiconductor industry? The electronic materials advisory firm TECHCET offers insight.
President Biden Signs CHIPS Act Into Law
The legislation provides a 25% tax credit for U.S. facilities that produce semiconductors or chipmaking equipment and $52 billion in funding for new semiconductor programs.
The Democratization of Chip Design
The open-source silicon movement with a community-based, open-source platform of easy-to-use, easy-to-access tools is a practical and efficient way to ensure innovation and has the potential to drive exponential semiconductor industry growth.
InnovationLab Demonstrates Breakthrough PCB Production Method Based on Additive Manufacturing
InnovationLab, the expert in printed electronics “from lab to fab”, announces it has achieved a breakthrough in additive manufacturing of printed circuit boards (PCBs), helping meet higher environmental standards for electronics production while also reducing costs.
US/China Tension Must Be Seen in the Context of Taiwan’s TSMC’s Critical Role in the Global Semi Supply Chain
Following the news of raising tension between the US and China as a result of US House Speaker Nancy Pelosi recent visit to Taiwan; Josep Bori, Research Director in the Thematic team at GlobalData, a leading data and analytics company, offers his view.
Accellera Announces Proposed Working Group to Explore Clock Domain Crossing Standard
Accellera Systems Initiative (Accellera) announced today the formation of a Proposed Working Group (PWG) to focus on defining a standard Clock Domain Crossing (CDC) collateral specification to ease SOC integration.
Scaling Progress Takes Many Paths at VLSI Symposium
The IEEE 2022 Symposium on VLSI Technology and Circuits attracted 650 people to attend in person in Honolulu, and an equal number of virtual attendees.
Industry Reacts to Passage of CHIPS and Science Act of 2022
Semiconductor companies around the globe issued statements on Thursday following the passage of legislation of the CHIPS and Science Act of 2022 in the U.S. House of Representatives aimed at increasing American semiconductor manufacturing.
Flexible Hybrid Capacitors Based on Transition Metal Composite Electrode
The shortage of fossil energy sources lead to high requirements for the exploration of sustainable energy conversion and storage equipment. Supercapacitor (SC) is a kind of excellent energy storage device due to the high power density and long cycle life. However, the low energy density restricts their further practical application. Therefore, it is extremely important to develop high-performance electrode materials with excellent performances.
