Heraeus Electronics this week announced the launch of its new Condura.ultra Ag free AMB Substrate.
Design
Self-Driving Technology Firm Sensible 4 Receives €8 Million to Boost Sustainable Transport
The European Investment Bank (EIB) has granted an €8 million loan to Sensible 4 Oy, an innovative Finnish self-driving technology company that offers a complete and flexible autonomous driving software.
Voyager Supercomputer Enters Testbed Phase
Voyager, the experimental compute resource newly installed at the San Diego Supercomputer Center (SDSC), is ready for use.
Proposed Improvements to SiC MOSFET Power Converter Technology Overcome Existing Challenges
In order to get the most out of SiC MOSFETs and expand their use across a wide range of applications, researchers employed novel control technologies and strategies to improve how the SiC MOSFETs work in medium-voltage applications.
Alif and Edge Impulse Share Dramatic Increases in AI/ML Workload Performance
Alif Semiconductor, at the Embedded Vision Summit taking place May 16–19, 2022, will be joining Edge Impulse to demonstrate the dramatic increases in AI/ML workload performance and efficiency its Ensemble microcontrollers (MCUs) and fusion processors are able to deliver over traditional systems.
SIA Welcomes Kickoff Meeting of Conference Committee on Competition Legislation
Committee aims to reconcile differences between the Senate’s United States Innovation and Competition Act (USICA) and the House’s America COMPETES Act.
Classiq Announces the Classiq Coding Competition
Classiq today announced the Classiq Coding Competition, rewarding those that create highly-efficient quantum circuits to solve important real-world problems.
OMNIVISION and Valens Semiconductor Announce Partnership
The companies will demonstrate the joint A-PHY solution at AutoSens Detroit.
A New Age of 2.5D Materials
2.5-dimensional materials promise new applications for artificial intelligence, electronics, automobiles and the energy sector.
New Shape Memory Alloy Discovered Through Artificial Intelligence Framework
Funded by the National Science Foundation’s Designing Materials to Revolutionize Our Engineering Future (DMREF) Program, researchers from the Department of Materials Science and Engineering at Texas A&M University used an Artificial Intelligence Materials Selection framework (AIMS) to discover a new shape memory alloy.
