Heraeus Electronics this week announced the launch of its new Condura.ultra Ag free AMB Substrate. A cost-efficient, highly reliable, Ag free AMB substrate that enables bonding silicon-nitride-based ceramics with copper foils, Condura®.ultra was developed using a special technique enabling high-performance Si3N4 substrates by using new, Ag free active metal brazing (AMB) bonding technology.
Heraeus Electronics announced the new product launch at the start of PCIM Europe, the leading conference and exhibition for power electronics, renewable energy and energy management in Nuremberg. In parallel to PCIM Europe, SMTconnect is held in halls 4, 4A and 5.
In an effort to better support its customers, Heraeus Electronics has introduced Condura®.ultra which is designed to offer outstanding reliability and processing (e.g., sintering, bonding, soldering). The cost-efficient high-performance Si3N4 Ag free AMB substrate is available with standard and thick Cu layers and thermal conductivity of ≥60 W/m.K and ≥80 W/m.K.
With a comprehensive portfolio of metal ceramic substrates, Heraeus Electronics addresses the diverse needs of the Power Electronics segment, ranging from low-power applications up to the most demanding industries. The Condura® portfolio consists of Condura®.classic (DCB-Al2O3), Condura®.extra (DCB-ZTA), Condura®.prime (AMB-Si3N4), and the all new Condura®.ultra (Si3N4 Ag free AMB).
Heraeus Electronics’ metal ceramic substrates are recommended for power electronic modules (e.g., current drivetrain inverters) using MOSFETs or IGBT semiconductor devices and diodes for widespread applications in the fields of automotive, electric motor drives, UPS, power supplies, industrial automation and testing.
