Omni Design Technologies, a provider of high-performance, low-power mixed-signal Intellectual Property (IP) solutions, and EnSilica, a provider of custom ASIC design and supply solutions, today announced that they have entered into a partnership agreement.
Design
2022 Semiconductor Materials Outlook: COVID-19 Pandemic Still Having Lasting Effects on All Materials
The COVID-19 pandemic has created strong demand for both logic and memory ICs to support continued Work from Home and School from Home, and as such demand is expected to increase despite expanding availability of virus vaccines.
Electronic System Design Industry Logs 17% Year-Over-Year Revenue Growth in Q3 2021, ESD Alliance Reports
Electronic System Design (ESD) industry revenue increased 17.1% year-over-year from $2,953.9 million to $3,458.1 million in Q3 2021, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
New IDC Spending Guide Forecasts Double-Digit Growth for Investments in Edge Computing
Worldwide spending on edge computing is expected to be $176 billion in 2022, an increase of 14.8% over 2021.
DuPont To Launch Pyralux HP Laminate Adhesive System for High-Performance Electronics
DuPont Interconnect Solutions (ICS), a business within the Electronics & Industrial segment, will introduce the Pyralux HP laminate adhesive system at the 2022 Institute for Printed Circuits (IPC) APEX Exposition to be held in San Diego, CA from January 25 – 27, 2022.
Toshiba Opens the Way to Longer Life Wearables and IoT Devices With New IC Chips
Minute, ultra-low quiescent current load switch ICs yield huge performance improvements.
Gelest Inc. Names Dr. Jonathan Goff as President
Gelest Inc. names Dr. Jonathan Goff as President of Gelest effective immediately.
Micron Ships the Industry’s First 176-Layer QLC NAND in Volume and Unveils the 2400 PCIe Gen4 Client SSD
Micron Technology, Inc. today announced it has begun volume shipments of the world’s first 176-layer QLC NAND SSD. Built with the most advanced NAND architecture, Micron’s 176-layer QLC NAND delivers the industry’s leading storage density and optimized performance for a broad range of data-rich applications.
SPIE, the International Society for Optics and Photonics, Announces Its 2022 Society Awards
The Awards Committee of SPIE, the international society for optics and photonics, today announced the recipients of its prestigious annual awards.
Global Fab Equipment Spending Projected to Log Record High in 2022 to Mark Third Consecutive Year of Growth, SEMI Reports
Global fab equipment spending for front end facilities is expected to rise 10% year-over-year (YOY) in 2022 to a new all-time high of over US$98 billion, marking a third consecutive year of growth, SEMI highlighted today in its quarterly World Fab Forecast report.
