After a record-high start in 1Q21, semiconductor merger and acquisition announcements cool off a bit without the “megadeals” seen in 2020, says new update report.
Editor’s Picks
Panel-Level Heterogeneous Integration Technology for Analog ICs
Micro-transfer printing, a massively parallel pick-and-place process, may be used to produce HI analog ICs comprised of large arrays of ultra-thin separately manufactured components interconnected using redistribution layer technology.
Foundry Market Tracking Toward Record-Tying 23% Growth in 2021
Application processors for 5G smartphones, networking and data center processors drive growth at leading edge but demand seen across all segments.
Time-Resolved, In-Line Airborne Particle Sensing
IPS and wireless wafer/reticle format counters can detect particulate contamination events exactly when and where they occur, with results available in real-time, or stored for later analysis.
Sputter Targets & Metals Demand Met with COVID-impacted Lead-times and Costs
Delivery lead-times lengthening and costs spike as Targets Revenues push ahead 8.5% to US$740 Million.
What’s in the August/September Issue?
Each issue of Semiconductor Digest has articles found only in the magazine! Read the August/September issue…
3Q21 Earnings Outlooks Bode Well for Most Leading Semi Suppliers
IC Insights’ recently released its compilation of third-quarter sales growth expectations for the top-25 semiconductor…
Microprocessor Sales Will Continue Double-Digit Growth in 2021
The total MPU market is on track to exceed $100 billion for the first time ever this year, thanks to strong increases in cellphone application processor revenues, says Mid-Year Update.
Third Quarter Outlook on 2021 Semiconductor Materials
TECHCET announced 2021 semiconductor materials revenues will top $57B, growing by 8% to 30%, covering the spectrum of materials segments.
Getting the Most Out of Your System
In an article published in the June/July issue of Semiconductor Digest, imec researchers introduce a unique simulation framework. This helps designers manage the complexity of performing cross-‘world’ optimizations – in order to enable the grand applications of the future.
