CEA-Leti and the Centre for Research on Heteroepitaxy and its Applications (CRHEA) today announced R&D results that have cleared a path toward full-color microdisplays based on a single material system, a long-standing goal for augmented and virtual reality (AR/VR) technologies.
MEMS
MEMS & Imaging Sensors Summit to Spotlight Sensing Revolution for Europe’s Leadership
Industry experts will gather November 19-20 at the SEMI MEMS & Imaging Sensors Summit 2025 to explore the latest breakthroughs in AI-driven MEMS and imaging optimization, AR/VR technologies, and advanced sensor solutions for critical defence applications.
In-Situ Molecular Passivation Enables Pure-Blue Perovskite LEDs Via Vacuum Thermal Evaporation
Researchers report an in-situ passivation strategy for pure-blue perovskite light-emitting diodes (PeLEDs), promising for next-generation displays, fabricated by vacuum thermal evaporation.
Johns Hopkins Researchers Discover New Methods for Making Smaller Microchips
A team of scientists has discovered how to create circuits that are so small they’re invisible to the naked eye using a process that is both precise and economical for manufacturing.
New Research Suggests Path Toward More Durable Flexible Electronics
New research by engineers from Brown University has revealed surprising details about how cracks form in multilayer flexible electronic devices.
xMEMS Announces Mass Production Readiness of Cypress
xMEMS Labs today announced that its breakthrough Cypress full-range MEMS speaker, together with the Alta-S companion drive ASIC, is now ready for mass production.
What’s in the September Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the September issue.
proteanTecs Unveils Industry-Leading Voltage and Thermal Sensor Built for 2nm
proteanTecs today announced the availability of its silicon-proven, VDD-core only, LVTS (Local Voltage and Thermal Sensor), with a built-in fast over-temperature alert capability, for the 2nm process node.
ChipFoundry Acquires Efabless Assets
Umbralogic Technologies LLC, operating as ChipFoundry, today announced the successful acquisition of Efabless’ intellectual property and technology assets.
Reinventing Fiber-Based Pressure Sensors
Researchers develop fibers with a unique internal structure that enables highly accurate and sensitive pressure sensing.
