xMEMS Labs will unveil new AI smart glasses prototypes at its upcoming xMEMS Live Asia seminar series on September 16 in Taipei and September 18 in Shenzhen.
MEMS
New $3M U.S. National Science Foundation Grant Bolsters American Design and Manufacturing of Advanced 3D Chip Technologies
UChicago-led NSF ACE-3D Chip Design Hub will focus on propelling domestic computer chip manufacturing efforts.
Metalenz Expands Its Technologies in the Metasurface Market to Include System Level Sensing Applications
Metalenz, a specialist in metasurface innovation and commercialization, today announces the expansion of its product and patent portfolio, which now encompasses metasurface technology and system level applications for secure biometrics.
Researchers Build First ‘Microwave Brain’ on a Chip
Cornell University researchers have developed a low-power microchip they call a “microwave brain,” the first processor to compute on both ultrafast data signals and wireless communication signals by harnessing the physics of microwaves.
SEMI MEMS and Sensors NextGen Congress 2025 to Explore the Future of Sensing Technology
MEMS and Sensors NextGen Congress (MSNG) 2025, a technical event on sensor innovation, will bring together leaders from across the MEMS and sensors ecosystem from September 16-18 at the SEMI headquarters in Milpitas, Calif.
xMEMS Labs Announces 3rd Annual “xMEMS Live Asia” Seminar Series in Taipei and Shenzhen
xMEMS Labs today announced the return of its highly anticipated xMEMS Live Asia seminar series, taking place September 16 in Taipei and September 18 in Shenzhen.
SEMI Foundation Launches SEMIquest: An Immersive STEM Experience to Inspire Arizona’s Future Tech Talent
The SEMI Foundation, the nonprofit arm of SEMI, today announced the launch of SEMIquest, an immersive, hands-on STEM experience designed to ignite curiosity and connect Arizona’s students to the vast career opportunities in the semiconductor industry.
Dual-Function Organic Molecule May Advance Display Technologies and Medical Imaging
Researchers overcome a long-standing molecular design challenge by realizing efficient light emission and photon absorption in the same compound.
What’s in the July/August Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the July/August issue.
Arteris To Provide FlexGen Smart NoC IP In Next-Generation AMD AI Chiplet Designs
In a market reshaped by the compute demands of AI, Arteris, Inc. today announced AMD has licensed FlexGen network-on-chip (NoC) interconnect IP for its next generation of AI chiplet design.
