MEMS

The 2025 Symposium on VLSI Technology & Circuits – “Cultivating the VLSI Garden: From Seeds of Innovation to Thriving Growth”

For the 45th consecutive year delivering a unique convergence of microelectronics technology and circuits in one venue, the Symposium on VLSI Technology & Circuits will be held as an in-person event in Kyoto, Japan on June 8-12, 2025.

Lam Research Donates Leading-Edge Etch System to Accelerate Nanofabrication R&D at UC Berkeley

Lam Research Corp. today announced the donation of its innovative multi-chamber semiconductor etching system to the Marvell Nanofabrication Laboratory at the University of California, Berkeley to advance research and development (R&D) for next-generation chip technologies.

Driving Sustainable Manufacturing in ASEAN: The Ripple Effect of Validated Net-Zero Commitments

A promising pathway to achieving net-zero emissions in the manufacturing sector is through the adoption of validated commitments.

PI Expands US Manufacturing of Precision Motion Solutions

Physik Instrumente announced progress in the construction of its new production facility in Shrewsbury, Massachusetts.

JEDEC and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard

JEDEC Solid State Technology Association today announced the publication of its highly anticipated High Bandwidth Memory (HBM) DRAM standard: HBM4.

ASMC 2025 Showcases AI and Emerging Technologies Shaping the Future of Semiconductor Manufacturing

The 36th annual Advanced Semiconductor Manufacturing Conference (ASMC) 2025 will be held May 5-8, 2025, in Albany, New York, bringing together leaders in semiconductor manufacturing to explore cutting-edge advancements driving high-volume production and AI-powered innovation.

Canatu Signs Joint Development Agreement with DENSO to Improve Carbon Nanotube Performance

Canatu Plc has signed a one-year joint development agreement with DENSO Corporation, a supplier of automotive technology and components, to improve the performance of Canatu carbon nanotubes.

STMicroelectronics Details Company-Wide Program to Reshape Manufacturing Footprint

STMicroelectronics today disclosed further elements of its program to reshape its global manufacturing footprint.

From Microelectronics to Microfluidics: How 3D Printing Is Shaping the Future of Tiny Devices

The world of micro and nano devices is undergoing a seismic shift, thanks to the latest advancements in 3D printing technology.

Omnitron Sensors Appoints Ijaz Jafri as Vice President of Engineering

Dr. Jafri brings a 20+-year track record of successfully bringing disruptive MEMS and semiconductor technologies to market in the automotive, industrial, aerospace, defense and consumer sectors.

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