Purdue University announced Tuesday (April 11) the hire of Mark Lewis as the first chief executive officer of the Purdue Applied Research Institute (PARI), the nonprofit applied research arm of Purdue with a particular focus on national security, economic security and food security for the United States.
MEMS
Samsung Electronics and AMD Extend Strategic IP Licensing Agreement
Samsung Electronics Co., Ltd. and AMD today announced they have signed a multi-year agreement extension to bring multiple generations of high-performance, ultra-low-power AMD Radeon graphics solutions to an expanded portfolio of Samsung Exynos SoCs.
Wise-integration & Powernet Team Up to Deliver Digitally Controlled, Compact, Energy-Efficient GaN Power Supply Systems
Wise-integration, a French pioneer in digital control of gallium nitride (GaN) power supplies and GaN ICs, and Powernet, a Korean power supply manufacturer, today announced an agreement to build compact and energy-efficient technology for power-supply applications that are currently limited to analog control.
SEMIFIVE Achieves Mass Production Milestone of its SoC Platform
SEMIFIVE, a design solution provider and pioneer of platform-based custom silicon solutions, announced it has begun mass production of its first SoC Platform-based AI chip product built on Samsung Foundry’s matured 14nm FinFET technology.
Rapidus, Japan’s Newly Founded Chip Manufacturer, Joins imec’s Core Partner Program
Imec and Rapidus, Japan’s newly founded chip manufacturer, today announced that they have taken an important next step in setting up a long-term and sustainable collaboration in the domain of advanced semiconductor research, with Rapidus joining imec’s Core Partner Program.
Semiconductor Research Corporation announces 2023 Call for Research, $16.5M in Funding Opportunities
Semiconductor Research Corporation (SRC) is announcing the launch of solicitation season. Calls for research will begin in early April and will run through May.
Critical Manufacturing Announces MESI 4.0 Summit: Connect for a Smarter Future
The MES & Industry 4.0 International Summit, to be held on September 7 – 8, 2023 at Alfândega Congress Centre in Porto, is aimed to help manufacturers ‘Connect for a Smarter Future’.
U.S. Secretary of Commerce Gina Raimondo Announces Fiber Manufacturing Expansions in North Carolina
Today, as part of the Biden-Harris Administration’s Investing in America tour, U.S. Secretary of Commerce Gina Raimondo and Assistant Secretary of Commerce for Communications and Information Alan Davidson traveled to Hickory, NC to celebrate the announcement of new fiber optic cable production in the U.S. made possible by the Administration’s Internet for All Initiative.
New SIA Map Highlights Broad U.S. Semiconductor Ecosystem
The semiconductor ecosystem in the United States is broad and diverse, as illustrated by SIA’s new U.S. Semiconductor Ecosystem Map, a first-of-its-kind tool that allows users to explore industry activities across the country, including nearly 500 locations in 42 states.
New Chip Design to Provide Greatest Precision in Memory to Date
A team led by USC, MIT, and the University of Massachusetts, developed a protocol for devices to reduce “noise” and demonstrated the practicality of using this protocol in integrated chips.
