Under the theme, “The 75th anniversary of the Transistor and the Next Transformative Devices to Address Global Challenges,” the 68th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.
Packaging
Showa Denko Starts Shipment of Newly Developed HD Media for Record-breaking 26TB Near-line HDD
Showa Denko K.K. (SDK) has started shipment of newly developed 3.5-inch hard disk media (HD media) to be used in 26 terabyte (TB) hard disk drive (HDD), which has the largest storage capacity the HDD industry has ever produced.
Beyond Semiconductor Packaging Materials: Advanced Silicone Solutions
Advanced silicones are enabling semiconductor manufacturers to address a variety of challenges.
EV Group Lithography Solutions for Heterogenous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2022
EV Group (EVG) announced that new developments in heterogeneous integration and wafer-level packaging enabled by its advanced lithography solutions will be highlighted in several papers being presented at the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), to be held May 31-June 3 in San Diego, Calif.
Samsung Electronics and Red Hat Announce Collaboration in the Field of Next-Generation Memory Software
Samsung Electronics Co., Ltd. and Red Hat, Inc. today announced a broad collaboration on software technologies for next-generation memory solutions.
CMP Consumables – Supply is Tight and Costs Expected to Rise
TECHCET announced the Chemical Mechanical Planarization (CMP) consumables market for semiconductors grew almost 13% in 2021 to reach US$3.0 billion.
Strong Growth in Wafer Capacity for Image Sensors Expected
Global installed capacity for image sensors was one million 200mm-equivalent wafers per month at the end of 2021.
Voyager Supercomputer Enters Testbed Phase
Voyager, the experimental compute resource newly installed at the San Diego Supercomputer Center (SDSC), is ready for use.
Pall Corporation Invests in New Manufacturing Facility to Support Growing Semiconductor Demand
Pall Corporation announced the construction of a new manufacturing facility focused on solutions that will serve advanced nodes for semiconductor manufacturers.
Heraeus Electronics Introduces Optimized Copper Ribbon for Laser Bonding at PCIM Europe
Heraeus Electronics today announced the launch of its new PowerCu Soft Laser Ribbons (LRB) for Laser Bonding during PCIM Europe in Nuremburg.
