Boosting power semiconductor production capacity in response to growing demand for EVs.
Packaging
DuPont Opens New Kapton and Pyralux Production Line in Circleville, Ohio
DuPont Interconnect Solutions, a business within the Electronics & Industrial segment, recently held a ribbon-cutting ceremony with elected officials and business leaders to formally mark the completion of its $250 million capital project to expand production of Kapton polyimide film and Pyralux flexible circuit materials at the Circleville manufacturing site.
Pfeiffer Vacuum Opens New Leak Detection and Vacuum Technology Facility in Indianapolis, Indiana
Pfeiffer Vacuum, a provider of vacuum and leak detection solutions for the semiconductor as well as the analytical, industrial and research & development markets, opened up a new 40,000 square foot facility on May 13th.
Proposed Improvements to SiC MOSFET Power Converter Technology Overcome Existing Challenges
In order to get the most out of SiC MOSFETs and expand their use across a wide range of applications, researchers employed novel control technologies and strategies to improve how the SiC MOSFETs work in medium-voltage applications.
STMicroelectronics and MACOM RF Gallium-Nitride-on-Silicon Prototypes Achieve Technology and Performance Milestones
STMicroelectronics and MACOM Technology Solutions Holdings Inc. have announced the successful production of radio-frequency Gallium-Nitride-on Silicon (RF GaN-on-Si) prototypes.
SIA Welcomes Kickoff Meeting of Conference Committee on Competition Legislation
Committee aims to reconcile differences between the Senate’s United States Innovation and Competition Act (USICA) and the House’s America COMPETES Act.
SkyWater Enters License Agreement with Xperi for Hybrid Bonding Technology
Hybrid bonding capability strongly complements SkyWater’s developing portfolio of heterogeneous integration solutions including silicon interposer and fan-out packaging.
Mitsubishi Electric Expands Silicon Carbide Power Device Lineup With Industry Standard Package Dual Device
Mitsubishi Electric US, Inc. recently launched a new Silicon Carbide (SiC) power module FMF400DY-24B
Tachyum Delivers the Highest AI and HPC Performance with the Launch of the World’s First Universal Processor
Tachyum today launched the world’s first universal processor, Prodigy, which unifies the functionality of a CPU, GPU and TPU in a single processor, creating a homogeneous architecture, while delivering massive performance improvements at a cost many times less than competing products.
STMicroelectronics Cooperates with Semikron on Silicon-Carbide Power Technology
STMicroelectronics has revealed it is supplying silicon carbide (SiC) technology for the eMPack electric-vehicle (EV) power modules from Semikron, one of the world’s leading manufacturers of power modules and systems.
